Searched for: subject%3A%22Surface%255C%2Bmount%255C%2Bassembly%255C%2Bfor%255C%2Bcommunication%255C%2Bk%255C-band%255C%2Bsystems%255C%2B%255C%2528SMACKS%255C%2529%22
(1 - 1 of 1)
van Heijningen, M. (author), Gauthier, G. (author)
This paper presents a novel approach to realize low-cost millimeter-wave modules using only SMD packaged MMICs integrated on a single organic substrate. This approach is demonstrated on a 38 GHz transceiver module for point-to-point LMDS communication systems. The required SMD package technology and demonstrator have been developed in the 5th...
conference paper 2004