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van Es, M.H. (author), Quesson, B.A.J. (author), Mohtashami, A. (author), Piras, D. (author), Hatakeyama, K. (author), Fillinger, L. (author), van Neer, P.L.M.J. (author)In order to extract ever more performance from semiconductor devices on the same device area, the semiconductor industry is moving towards device structures with increasingly complex material combinations and 3D geometries. To ensure cost effective fabrication of next generation devices, metrology solutions are needed that tackle the specific...conference paper 2020
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Dresscher, M. (author), Jayawardhana, B. (author)We study a containment control problem (CCP) and a shape control problem (SCP) for systems whose initial condition is a random variable with known distribution. The two control problems both require exponential convergence to a desired trajectory, which is complemented by either; (i) a required cumulative distribution over a prescribed...article 2020
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Hafkamp, T. (author), van Baars, G. (author), de Jager, B. (author), Etman, P. (author)Technical ceramics for high-performance applications can be additively manufactured using vat photopolymerization technology. This technology faces two main challenges: increasing ceramic product size and improving product quality. The integration of process control strategies into AM equipment is expected to play a key role in tackling these...article 2019
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Hunicz, J. (author), Mikulski, M. (author), Rybak, A. (author)Controlled auto-ignition (CAI) is an advanced combustion technology offering high thermal efficiency and low NOX emissions. One promising approach to achieve CAI combustion is application of negative valve overlap resulting in internal exhaust gas re-circulation. However, combustion control is still an issue which should be resolved before wide...conference paper 2018
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Hafkamp, T. (author), van Baars, G. (author), de Jager, B. (author), Etman, P. (author)Vat photopolymerization is a prominent additive manufacturing technology for the fabrication of near-net shape ceramic parts. To serve the high tech industry’s needs, additive manufacturing equipment has to scale up to larger product sizes and higher, repeatable product quality. This motivates the integration of more process monitoring and...article 2018
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van der Kleij, R. (author), Hueting, T.F. (author), Schraagen, J.M.C. (author)Dynamic Positioning (DP) is a computer-controlled process to automatically keep a floating vessel at a specific position or to follow a pre-defined path (tracking) by using its own propellers and thrusters. The human supervisory controller has no direct need to constantly know what the status is of all parts of the automation and the system it...article 2018
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Snel, R. (author), Winters, J. (author), Liebig, T. (author), Jonker, W.A. (author)Contemporary production systems of mechanical precision parts show challenges as increased complexity, tolerances shrinking to sub-microns and yield losses that must be mastered to the extreme. More advanced automation and process control is required to accomplish this task. Often a solution based on feedforward/feedback control is chosen...conference paper 2017
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Bussink, P.G.W. (author), Volatier, J.B. (author), van der Walle, P. (author), Fritz, E.C. (author), van der Donck, J.C.J. (author)The Rapid Nano is a particle inspection system developed by TNO for the qualification of EUV reticle handling equipment. The detection principle of this system is dark-field microscopy. The performance of the system has been improved via model-based design. Through our model of the scattering process we identified two key components to improving...conference paper 2016
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Keyvani, A. (author), Tamer, M.S. (author), van Es, M.H. (author), Sadeghian Marnani, H. (author)In this paper we present a new AFM based nano-patterning technique that can be used for fast defect repairing of high resolution photomasks and possibly other high-speed nano-patterning applications. The proposed method works based on hammering the sample with tapping mode AFM followed by wet cleaning of the residuals. On the area where a...conference paper 2016
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Kuiper, S. (author), Fritz, E.C. (author), Crowcombe, W.E. (author), Liebig, T. (author), Kramer, G.F.I. (author), Witvoet, G. (author), Duivenvoorde, T. (author), Overtoom, A.J. (author), Rijnbeek, R.A. (author), van Zwet, E.J. (author), van Dijsseldonk, A. (author), den Boef, A. (author), Beems, M. (author), Levasier, L. (author)Nowadays most overlay metrology tools assess the overlay performance based on marker features which are deposited next to the functional device features within each layer of the semiconductor device. However, correct overlay of the relatively coarse marker features does not directly guarantee correct overlay of the much smaller device features....conference paper 2016
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van Es, M.H. (author), Sadeghian Marnani, H. (author)Inspection of EUV mask substrates and blanks is demanding. We envision this is a good target application for massively parallel Atomic Force Microscopy (AFM). We envision to do a full surface characterization of EUV masks with AFM enabling 1nm true 3D resolution over the entire surface. The limiting factor to do this is in the sensor itself:...conference paper 2016
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Bijster, R.J.F. (author), Sadeghian Marnani, H. (author), van Keulen, F. (author)Optical near-field technologies such as solid immersion lenses and hyperlenses are candidate solutions for high resolution and high throughput wafer inspection and metrology for the next technology nodes. Besides sub-diffraction limited optical performance, these concepts share the necessity of extreme proximity to the sample at distances that...conference paper 2016
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Kachko, A. (author), van der Ham, L.V. (author), Bardow, A. (author), Vlugt, T.J.H. (author), Goetheer, E.L.V. (author)Chemical absorption of CO2 using aqueous amine-based solvents is one of the common approaches to control acidic gases emissions to the atmosphere. Improvement in the efficiency of industrial processes requires precise monitoring tools that fit with the specific application. Process monitoring using in-line multivariate measurement methods...article 2016
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Sadeghian Marnani, H. (author), Dekker, A. (author), Herfst, R.W. (author), Winters, J. (author), Eigenraam, A.B.C. (author), Rijnbeek, R.A. (author), Nulkes, N. (author)With the device dimensions moving towards the 1X node and below, the semiconductor industry is rapidly approaching the point where existing metrology, inspection and review tools face huge challenges in terms of resolution, the ability to resolve 3D and the throughput. Due to the advantages of sub-nanometer resolution and the ability of true 3D...conference paper 2015
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Kane, R.D. (author), Srinivasan, S. (author), Khakharia, P.M. (author), Goetheer, E.L.V. (author), Mertens, J. (author), de Vroey, S. (author)Over the past several years, there has been a significant effort to bring corrosion monitoring into the realm of online, real-time management with plant process control technology. As part of this new direction in corrosion monitoring, corrosion data (e.g. information on corrosion rate, measured Stern Geary constant (or B value), and parameters...conference paper 2015
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van der Ham, L.V. (author), Bakker, D.E. (author), Geers, L.F.G. (author), Goetheer, E.L.V. (author)The solvent and the dissolved CO2 concentrations are two essential properties of CO2 absorption processes. Currently, they are typically monitored using time-consuming offline analytical techniques. Initial development efforts aiming at a cost-effective and reliable inline monitoring system are described. Using a fractional factorial...article 2014
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Maas, D.J. (author), van Zwet, E.J. (author)In lithography, overlay control is getting increasingly complex. Advanced Process Control (APC) is introduced to minimize excursions from the process window for the present exposure. APC uses metrology data of previously exposed wafers, hence, there is always a delay of tens of minutes before the required information is available. This paper...conference paper 2014
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Sadeghian Marnani, H. (author), Koster, N.B. (author), van den Dool, T.C. (author)The main driver for Semiconductor and Bio-MEMS industries is decreasing the feature size, moving from the current state-of-the-art at 22 nm towards 10 nm node. Consequently smaller defects and particles become problematic due to size and number, thus inspecting and characterizing them are very challenging. Existing industrial metrology and...conference paper 2013
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Oosterink, M. (author)This white paper describes solutions which organisations may use to improve the security of their legacy process control systems. When we refer to a legacy system, we generally refer to old methodologies, technologies, computer systems or applications which are still in use, despite the fact that new technologies or more efficient methods are...other 2012
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Luiijf, H.A.M. (author)Het onderhoud, de monitoring en de bediening van technische gebouwinstallaties gebeurt steeds vaker op afstand, vanaf een andere locatie, door een extern bedrijf via internet. De redenen zijn helder: het is handig en bespaart kosten. Maar is het ook veilig? Grote kans dat dat niet zo is. De hoogste tijd voor een stuk bewustwording van het risico...article 2012
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