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Kok, W.D. (author), Kruithof, M.C. (author)One of the main challenges in detecting a nano-sized particle on a ‘rough’ surface is to differentiate the particle from speckle that is caused by the substrate. The ‘traditional’ approach in particle detection is to record multiple images under varying illuminations, and sum the recorded irradiance distributions. Since the speckles will be...other 2019
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Koek, W.D. (author), van Zwet, E.J. (author), Sadeghian Marnani, H. (author)Traditionally, (dark field) imaging based, particle detection systems rely on identifying a particle based on its irradiance. It can be shown that for a very smooth wafer with 0.1 nm surface roughness (rms) this approach results in a particle detection limit larger than 20 nm. By carefully studying the physical mechanism behind this practical...conference paper 2016
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- Crowcombe, W.E. (author), Hollemans, C.L. (author), Fritz, E.C. (author), van der Donck, J.C.J. (author), Koster, N.B. (author) other 2014
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Crowcombe, W.E. (author), Hollemans, C.L. (author), Fritz, E.C. (author), van der Donck, J.C.J. (author), Koster, N.B. (author)Particle free handling of EUV reticles is a major concern in industry. For reaching economically feasible yield levels, it is reported that Particle-per-Reticle-Pass (PRP) levels should be better than 0.0001 for particles larger than 18 nm. Such cleanliness levels are yet to be reported for current reticle handling systems. A reticle handler was...conference paper 2014
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van der Donck, J.C.J. (author), Snel, R. (author), Stortelder, J. (author), Abutan, A. (author), Oostrom, S. (author), van Reek, S. (author), van der Zwan, B. (author), van der Walle, P. (author)Since 2006 EUV Lithographic tools have been available for testing purposes giving a boost to the development of fab infrastructure for EUV masks. The absence of a pellicle makes the EUV reticles extremely vulnerable to particles. Therefore, the fab infrastructure for masks must meet very strict particle requirements. It is expected that all new...conference paper 2011
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Technisch Physische Dienst TNO - TH (author), Meiling, H. (author), Banine, V. (author), Kürz, P. (author), Blum, B. (author), Heerens, G.J. (author), Harned, N. (author)With the realisation of the alpha-tool, ASML is progressing with the pre-commercialisation phase of its EUVL development. We report on the progress in the development of several key modules of the alpha-tool, including the source, wafer stage and reticle stage, wafer handling, baseframe, and optics modules. We demonstrate that the focus sensor...conference paper 2003