Searched for: subject%3A%22Microsystems%22
(1 - 13 of 13)
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Herrmann, A. (author), Erich, S.J.F. (author), Ven, L.G.J.V.D. (author), van Driel, W.D. (author), van Soestbergen, M. (author), Mavinkurve, A. (author), de Buyl, F. (author), Adan, O.C.G. (author)
conference paper 2017
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Tapaninen, O. (author), Myohanen, P. (author), Majanen, M. (author), Sitomaniemi, A. (author), Olkkonen, J. (author), Hildenbrand, V. (author), Gielen, A.W.J. (author), Mackenzie, F.V. (author), Barink, M. (author), Smilauer, V. (author), Patzak, B. (author)
This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This...
conference paper 2016
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Sharma, M.K. (author), Wieringa, F.P. (author), Frijns, A.J.H. (author), Kooman, J.P. (author)
Introduction: End-stage renal disease (ESRD) patients depend on dialysis for removal of toxic waste products, fluid overload relief and maintenance of electrolyte balance. Dialysis prolongs millions of lives. To some extent, ESRD has become a manageable disease with a steadily growing dialysis population of increasing average age and associated...
article 2016
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Yazdan Mehr, M. (author), Bahrami, A. (author), Fischer, H.R. (author), Gielen, S. (author), Corbeij, R. (author), van Driel, W.D. (author), Zhang, G.Q. (author)
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning...
conference paper 2015
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Subbaiyan, D. (author), Pakula, L.S. (author), French, P.J. (author), Lange, J.F. (author), Jeekel, J. (author), Kleinrensink, G.J. (author), Sterenborg, H.J.C. (author), Robinson, D.J. (author), van Zaane, F. (author), Kaptein, J.G. (author), Tang, K. (author), Pandraud, G. (author), van Veen, J. (author), Draaier, M. (author), Vakalapoulos, K.A. (author)
The result of the surgery can be seen after a couple of days when complications may occur. Doctors would like to have a tool to monitor and treat the patient during those days, while nowadays for many type of surgeries they can only wait. The authors of this paper are developing the wireless platform which will provide the monitoring and...
conference paper 2011
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Gromala, P. (author), Duerr, J. (author), Dressler, M. (author), Jansen, K.M.B. (author), Hawryluk, M. (author), de Vreugd, J. (author)
Numerical simulation plays an important role in product design. Its accuracy relays on a detailed description of geometry, material models, load and boundary conditions. This paper focuses on a new approach of FEM material modeling of three commercially available molding compounds. Curing shrinkage, modulus of elasticity and coefficient of...
conference paper 2011
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Altena, G. (author), Hohlfeld, D. (author), Elfrink, R. (author), Goedbloed, M.H. (author), van Schaijk, R. (author)
This paper reports on the design, modelling, fabrication and characterization of an electret-based MEMS electrostatic energy harvester with an elegant and robust process flow. The fabrication is based on a SOI wafer with self-aligned electrodes of the variable capacitor. The output current of the device shows distinct steps that are caused by...
conference paper 2011
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Barink, M. (author), van den Berg, D. (author), Yakimets, I. (author), Meinders, E.R. (author), TNO Industrie en Techniek (author)
The challenge of lithographic production of electronic circuitry on polymer foil is that deformations approaching the feature sizes of the circuitry can cause considerable overlay problems and thereby malfunctioning of the devices. The substrate foil is susceptible to several types of deformations. Accurate prediction of these deformations is of...
conference paper 2010
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Kregting, R. (author), Gielen, A.W.J. (author), van Driel, W. (author), Alkemade, P. (author), Miro, H. (author), Kamminga, J.-D. (author), TNO Industrie en Techniek (author)
Intrinsic stresses in bondpads may lead to early failure of IC's. In order to determine the intrinsic stresses in semiconductor structures, a new procedure is set up. This procedure is a combined experimental/numerical approach which consists of the following steps: First, a conductive gold layer (20 nm thickness) is deposited on the power line...
conference paper 2010
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Gielen, A.W.J. (author), TNO Industrie en Techniek (author)
Automotive electronics, solid-state-lighting, and solar cells need have to operate under harsh circumstances, either by the kind of environment they operate in, such as automotive electronics under the hood, or by the long durations of exposure. In both cases traditional lifetime assessment methods are failing: The accelaration factors, who are...
conference paper 2010
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Barink, M. (author), Goorhuis, M. (author), Giesen, P. (author), Furthner, F. (author), Yakimets, I. (author), TNO Industrie en Techniek (author)
Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often...
conference paper 2009
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Wu, H. (author), Emadi, A. (author), de Graaf, G. (author), Leijtens, J.A.P. (author), Wolffenbuttel, R.F. (author), TNO Industrie en Techniek (author)
A 0.35 μm CMOS process has been used for on-chip integration of a sun sensor composed of a 2x2 photodiode array and a current-to-voltage amplifier. Unlike conventional sun sensors, a shade profile proportional to the angle of incidence of incoming light is projected onto the photodiodes. This concept enables an autonomous self-powered optical...
conference paper 2009
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Gielen, A.W.J. (author), Barink, M. (author), van de Brand, J. (author), van Mol, A.M.B. (author), TNO Industrie en Techniek (author)
In order to study the electrical-thermo-mechanical interaction in OLEDs, finite element based simulation models were developed. Two dimensional models were used to study detailed design effects, such as the location of the bus bars, while a three dimensional model was used to study the effect of differences between the two and three dimensional...
conference paper 2009
Searched for: subject%3A%22Microsystems%22
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