Searched for: subject%3A%22Microelectronics%22
(1 - 16 of 16)
document
Hendriks, R. (author)
public lecture 2021
document
Grillo, F. (author), Soethoudt, J. (author), Marques, E.A. (author), de Martin, L. (author), van Dongen, K. (author), van Ommen, J.R. (author), Delabie, A. (author)
article 2020
document
Mione, M.A. (author), Katsouras, I. (author), Creyghton, Y. (author), van Boekel, W. (author), Maas, J. (author), Gelinck, G. (author), Roozeboom, F. (author), Illiberi, A. (author)
High permittivity (high-k) materials have received considerable attention as alternatives to SiO2 for CMOS and low-power flexible electronics applications. In this study, we have grown high-quality ZrO2 by using atmospheric-pressure plasma-enhanced spatial ALD (PE-sALD), which, compared to temporal ALD, offers higher effective deposition rates...
article 2017
document
Herrmann, A. (author), Erich, S.J.F. (author), Ven, L.G.J.V.D. (author), van Driel, W.D. (author), van Soestbergen, M. (author), Mavinkurve, A. (author), de Buyl, F. (author), Adan, O.C.G. (author)
conference paper 2017
document
Tapaninen, O. (author), Myohanen, P. (author), Majanen, M. (author), Sitomaniemi, A. (author), Olkkonen, J. (author), Hildenbrand, V. (author), Gielen, A.W.J. (author), Mackenzie, F.V. (author), Barink, M. (author), Smilauer, V. (author), Patzak, B. (author)
This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This...
conference paper 2016
document
Yazdan Mehr, M. (author), Bahrami, A. (author), Fischer, H.R. (author), Gielen, S. (author), Corbeij, R. (author), van Driel, W.D. (author), Zhang, G.Q. (author)
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning...
conference paper 2015
document
Yuan, C.A. (author), Kregting, R. (author), van Driel, W. (author), Gielen, A.W.J. (author), Xiao, A. (author), Zhang, G.Q. (author)
High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital...
conference paper 2011
document
Gromala, P. (author), Duerr, J. (author), Dressler, M. (author), Jansen, K.M.B. (author), Hawryluk, M. (author), de Vreugd, J. (author)
Numerical simulation plays an important role in product design. Its accuracy relays on a detailed description of geometry, material models, load and boundary conditions. This paper focuses on a new approach of FEM material modeling of three commercially available molding compounds. Curing shrinkage, modulus of elasticity and coefficient of...
conference paper 2011
document
Gelinck, G.H. (author), Heremans, P. (author), Nomoto, K. (author), Anthopoulos, T.D. (author), TNO Industrie en Techniek (author)
Organic thin-film transistors (OTFTs) offer unprecedented opportunities for implementation in a broad range of technological applications spanning from large-volume microelectronics and optical displays to chemical and biological sensors. In this Progress Report, we review the application of organic transistors in the fields of flexible optical...
article 2010
document
Belleville, M. (author), Fanet, H. (author), Fiorini, P. (author), Nicole, P. (author), Pelgrom, M.J.M. (author), Piguet, C. (author), Hahn, R. (author), van Hoof, C. (author), Vullers, R. (author), Tartagni, M. (author), Cantatore, E. (author)
Energy efficiency of electronic systems has emerged as one of the most important trends in integrated circuits research in recent years. The results of this continued effort are visible in all kinds of electronic functions: DSPs (reaching the 10 μW/MMAC according Gene's law), data converters (the FOM of recent ADCs is approaching 15 fJ...
article 2010
document
Barink, M. (author), van den Berg, D. (author), Yakimets, I. (author), Meinders, E.R. (author), TNO Industrie en Techniek (author)
The challenge of lithographic production of electronic circuitry on polymer foil is that deformations approaching the feature sizes of the circuitry can cause considerable overlay problems and thereby malfunctioning of the devices. The substrate foil is susceptible to several types of deformations. Accurate prediction of these deformations is of...
conference paper 2010
document
Kregting, R. (author), Gielen, A.W.J. (author), van Driel, W. (author), Alkemade, P. (author), Miro, H. (author), Kamminga, J.-D. (author), TNO Industrie en Techniek (author)
Intrinsic stresses in bondpads may lead to early failure of IC's. In order to determine the intrinsic stresses in semiconductor structures, a new procedure is set up. This procedure is a combined experimental/numerical approach which consists of the following steps: First, a conductive gold layer (20 nm thickness) is deposited on the power line...
conference paper 2010
document
Gielen, A.W.J. (author), TNO Industrie en Techniek (author)
Automotive electronics, solid-state-lighting, and solar cells need have to operate under harsh circumstances, either by the kind of environment they operate in, such as automotive electronics under the hood, or by the long durations of exposure. In both cases traditional lifetime assessment methods are failing: The accelaration factors, who are...
conference paper 2010
document
Barink, M. (author), Goorhuis, M. (author), Giesen, P. (author), Furthner, F. (author), Yakimets, I. (author), TNO Industrie en Techniek (author)
Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often...
conference paper 2009
document
Gielen, A.W.J. (author), Barink, M. (author), van de Brand, J. (author), van Mol, A.M.B. (author), TNO Industrie en Techniek (author)
In order to study the electrical-thermo-mechanical interaction in OLEDs, finite element based simulation models were developed. Two dimensional models were used to study detailed design effects, such as the location of the bus bars, while a three dimensional model was used to study the effect of differences between the two and three dimensional...
conference paper 2009
document
Ditzel, M. (author), Otten, R.H.J.M. (author), Serdijn, W.A. (author), TNO Defensie en Veiligheid (author)
The task of the system architect is to take the correct early decisions despite the uncertainties. Power-Aware Architecting provides a systematic way to support the system architect in this job. Therefore, an iterative system-level design approach is defined where iterations are based on fast and accurate estimations or predictions of area,...
book 2007
Searched for: subject%3A%22Microelectronics%22
(1 - 16 of 16)