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- Void formation and bond strength investigated for wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bonding
- Vehicle state estimator based regenerative braking implementation on an electric vehicle to improve lateral vehicle stability
- X-ray imager using solution processed organic transistor arrays and bulk heterojunction photodiodes on thin, flexible plastic substrate
- Flexible barrier technology for enabling rollable AMOLED displays and upscaling flexible OLED lighting
- Low temperature sintering of inkjet printed metal precursor inks for organic electronic applications
- Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods
- Disruption of the electrical conductivity of highly conductive poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) by hypochlorite
Searched for: subject%3A%22Mechatronics%252C%255C%2BMechanics%255C%2B%2526%255C%2BMaterials%22
(81 - 100 of 914)