Back End Monolithic Serial Interconnection Technology for CIGS with Shunt-free Laser Scribing and Inkjet Printing

Back end interconnection technology is presented for CIGS using laser scribing and inkjet printing of dielectric material. Shunt-free laser scribing of CIGS is shown, which is essential in the back end approach for monolithic serial interconnection. Full back end interconnected mini-modules of 20x20cm2 were made and show no electrical losses...

Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods

Systems-in-foil technologies address the current need to manufacture low-cost, low-complexity and high-reliabiltiy large area organic electronics in the field of OLEDs, OPVs and sensors. For substrates with multiple layers of conductive tracks, there is a need to realize contact positions on either side of the foil. Unfortunately, typical...