Searched for: subject%3A%22Interconnection%255C%2Btechnology%22
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Gevaerts, V.S. (author), Biezemans, A.F.K.V. (author), Mannetje, H.H.L. (author), Linden, H. (author), Bosman, J. (author)
Back end interconnection technology is presented for CIGS using laser scribing and inkjet printing of dielectric material. Shunt-free laser scribing of CIGS is shown, which is essential in the back end approach for monolithic serial interconnection. Full back end interconnected mini-modules of 20x20cm2 were made and show no electrical losses...
conference paper 2018
Peter, M. (author), van den Ende, D. (author), van Remoortere, B. (author), van Put, S. (author), Podprocky, T. (author), Henckens, A. (author), van den Brand, J. (author)
Systems-in-foil technologies address the current need to manufacture low-cost, low-complexity and high-reliabiltiy large area organic electronics in the field of OLEDs, OPVs and sensors. For substrates with multiple layers of conductive tracks, there is a need to realize contact positions on either side of the foil. Unfortunately, typical...
conference paper 2013