Advances in Li-Ion battery management for electric vehicles

This paper aims at presenting new solutions for advanced Li-Ion battery management to meet the performance, cost and safety requirements of automotive applications. Emphasis is given to monitoring and controlling the battery temperature, a parameter which dramatically affects the performance, lifetime, and safety of Li-Ion batteries. In addition...

Design, fabrication and characterisation of nano-imprinted single mode waveguide structures for intra-chip optical communications

In the Information and Communications Technology (ICT) sector, the demands on bandwidth continually grow due to increased microprocessor performance and the need to access ever increasing amounts of stored data. The introduction of optical data transmission (e.g. glass fiber) to replace electronic transmission (e.g. copper wire) has alleviated...

Cyclic Etch/Passivation-Deposition as an All-Spatial Concept toward High-Rate Room Temperature Atomic Layer Etching

Conventional (3D) etching in silicon is often based on the ‘Bosch’ plasma etch with alternating half-cycles of a directional Sietch and a fluorocarbon polymer passivation. Also shallow feature etching is often based on cycled processing. Likewise, ALD is time-multiplexed, with the extra benefit of half-reactions being self-limiting, thus...

Flexible thin-film NFC tags

Thin-film transistor technologies have great potential to become the key technology for leafnode Internet of Things by utilizing the NFC protocol as a communication medium. The main requirements are manufacturability on flexible substrates at a low cost while maintaining good device performance characteristics, necessary to be compatible with...

Atomic Layer Etching: What can we learn from Atomic Layer Deposition?

Current trends in semiconductor device manufacturing impose extremely stringent requirements on nanoscale processing techniques, both in terms of accurately controlling material properties and in terms of precisely controlling nanometer dimensions. To take nanostructuring by dry etching to the next level, there is a fast growing interest in so...

Tuning the viscosity of halogen free bulk heterojunction inks for inkjet printed organic solar cells

For the solution processing of organic photovoltaics on an industrial scale, the exclusion of halogenated solvents is a necessity. However, the limited solubility of most semiconducting polymer/fullerene blends in non-halogenated solvents results in ink formulations with low viscosities which poses limitations to the use of roll-to-roll...

Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL

Polymer-based integrated optics is attractive for inter-chip optical interconnection applications, for instance, for coupling photonic devices to fibers in high density packaging. In such a hybrid integration scheme, a key challenge is to achieve efficient optical coupling between the photonic chips and waveguides. With the single-mode polymer...

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

Well-defined high resolution structures with excellent electrical conductivities are key components of almost every electronic device. Producing these by printing metal based conductive inks on polymer foils represents an important step forward towards the manufacturing of plastic electronic products on an industrial scale. The development of...

Integration of flexible AMOLED displays using oxide semiconductor TFT backplanes

AMOLED displays using oxide TFTs and high-quality moisture barrier were fabricated on ultrathin, flexible plastic substrates to give maximum mechanical flexibility. Total display thickness is below 150μm, and repeated rollability at 1 cm roll radius has been demonstrated. Electrical/Mechanical characteristics and reliability of the flexible...

Organic imager on readout backplane based on TFTs with cross-linkable dielectrics

We report on the fabrication of imagers based on organic semiconductors both in the photodiode layer and in the readout backplane. The photodiode is based on evaporated ultrathin (<100 nm) stack of SubPc/C60, sensitive in the wavelength range between 300 and 650 nm. The readout circuit is a switch matrix fabricated with a solution processed...

Large area photonic flash soldering of thin chips on flex foils for flexible electronic systems: In situ temperature measurements and thermal modelling

In this work photonic energy from a high power xenon flash lamp is used for soldering thin chips on polyimide and polyester foil substrates using standard Sn-Ag-Cu lead free alloys. The absorption of the xenon light pulse leads to rapid heating of components and tracks up to temperatures above the solder melting temperature, while the...

Atmospheric spatial atomic layer deposition of in-doped ZnO

Indium-doped zinc oxide (ZnO:In) has been grown by spatial atomic layer deposition at atmospheric pressure (spatial-ALD). Trimethyl indium (TMIn), diethyl zinc (DEZ) and deionized water have been used as In, Zn and O precursor, respectively. The metal content of the films is controlled in the range from In/[In+Zn] = 0 to 23% by co-injecting the...

Roll-to-roll fabricated organic devices

Current sharing between diode clamps of polar capacitor bank

The layout of a capacitor bank with clamping diodes is investigated based on an experimental 5.5-kJ energy storage unit for pulsed power applications. While the current sharing between parallel-connected capacitors is good, it is not the case with parallel-connected clamping diodes. Despite a very-low-inductance busbar and attention to...