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Grant-Jacob, J.A. (author), Mills, B. (author), Feinaeugle, M. (author), Sones, C.L. (author), Oosterhuis, G. (author), Hoppenbrouwers, M.B. (author), Eason, R.W. (author)
We demonstrate the use of laser-induced forward transfer (LIFT) in combination with a novel donor replenishment scheme to print continuous copper wires. Wires of mm length, a few microns wide and submicron in height have been printed using a 800 nm, 1 kHz repetition rate, 150 fs pulsed laser. A 120 nm thick copper donor was used along with laser...
article 2013
Skolski, J.Z.P. (author), Römer, G.R.B.E. (author), Obona, J.V. (author), Ocelik, V. (author), Huis in 't Veld, A.J. (author), de Hosson, J.T.M. (author)
conference paper 2012
Oosterhuis, G. (author), Prenen, A. (author), Huis in 't veld, A.J. (author)
Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSVs) for chip stacking, but also for other interconnect steps like re-distribution layers and solder bumps. Especially in applications with a low number (<100 mm-2) of relatively large features (10-100 μm diameter) with high aspect...
conference paper 2011