Searched for: subject%3A%22Deposition%255C%2Bprocess%22
(1 - 6 of 6)
document
di Giacomo, F.D. (author), Fledderus, H. (author), Gorter, H. (author), Kirchner, G. (author), Vries, I.D. (author), Dogan, I. (author), Verhees, W. (author), Zardetto, V. (author), Najafi, M. (author), Zhang, D. (author), Lifka, H. (author), Galagan, Y. (author), Aernouts, T. (author), Veenstra, S. (author), Groen, P. (author), Andriesse, R. (author)
The industrialization of perovskite solar cells (PSC) require processes to efficiently deposit the constituent layers over large areas. In this work we optimized the use of slot die coating process for both sheet-to-sheet (S2S) and roll-to-roll (R2R) manufacturing. Particular focus have been put on the control of the uniformity of perovskite...
conference paper 2018
document
ten Veen, J.H. (author), Verreussel, R.M.C.H. (author), Ventra, D. (author), Zijp, M.H.A.A. (author)
Shale gas reservoir stimulation procedures (e.g. hydraulic fracturing) require upfront prediction and planning that should be supported by a comprehensive reservoir characterization. Therefore, understanding shale depositional processes and associated vertical and lateral sedimentological variability is key in predicting the character and...
conference paper 2014
document
Oosterhuis, G. (author), Huis in 't veld, A.J. (author), Chall, P. (author)
Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSV) for chip stacking, but also for other integrated Si-technology. Especially in applications with a low number (<100 mm-2) of relatively large (10-2- um diameter), high aspect ratio (1:5-1:20) vertical interconnects (TSV's),...
conference paper 2011
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Chen, P. (author), van Veldhoven, E. (author), Sanford, C.A. (author), Salemink, H.W.M. (author), Maas, D.J. (author), Smith, D.A. (author), Rack, P.D. (author), Alkemade, P.F.A. (author), TNO Industrie en Techniek (author)
A 25 keV focused helium ion beam has been used to grow PtC nanopillars on a silicon substrate by beam-induced decomposition of a (CH<sub>3</sub>) <sub>3</sub>Pt(C<sub>P</sub>CH<sub>3</sub>) precursor gas. The ion beam diameter was about 1 nm. The observed relatively high growth rates suggest that electronic excitation is the dominant mechanism...
article 2010
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van Deelen, J. (author), van Mol, A.M.B. (author), Poodt, P.W.G. (author), Grob, F. (author), Spee, C.I.M.A. (author), TNO Industrie en Techniek (author)
For the past decade TNO has been involved in the research and development of atmospheric pressure CVD (APCVD) and plasma enhanced CVD (PECVD) processes for deposition of transparent conductive oxides (TCO), such as tin oxide and zinc oxide. The use of atmospheric deposition processes allows for large scale roll to roll manufacturing, and is...
conference paper 2009
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TNO Defensie en Veiligheid (author), Kuśmierczyk-Michulec, J.T. (author), van Eijk, A.M.J. (author)
The variation of the extinction coefficient with wavelength can be presented as a power law function with a constant (related to the power factor) known as the Ångström coefficient. When the particle size distribution is dominated by small particles, usually associated with pollution, the Ångström coefficients are high; in clear conditions they...
conference paper 2007
Searched for: subject%3A%22Deposition%255C%2Bprocess%22
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