Quantum Inspire – QuTech’s platform for co-development and collaboration in Quantum Computing

The mission of QuTech is to bring quantum technology to industry and society by translating fundamental scientific research into applied research. To this end we are developing Quantum Inspire (QI), a full-stack quantum computer prototype for future co-development and collaborative R&D in quantum computing. A prerelease of this prototype system...

High-throughput scanning probe instruments for nanopatterning, alignment, and overlay metrology

As the pitch approaches the 10nm node, in order to meet current and future patterning challenges, high resolution techniques are required, complementary to extreme ultraviolet lithography (EUVL) for high volume manufacturing of nanodevices. These complementary techniques should have the following specifications: 1) High patterning resolution,...

Lab- and field-test results of MFIG, the first real-time vacuum-contamination sensor

To produce high-end products, clean vacuum is often required. Even small amounts of high-mass molecules can reduce product yield. The challenge is to timely detect the presence of relevant contaminants. Here is where MFIG can help1. The massfiltered ion gauge sensor (MFIG) continuously and selectively monitors the presence of high-mass...

Sub 20nm particle inspection on EUV mask blanks

The Rapid Nano is a particle inspection system developed by TNO for the qualification of EUV reticle handling equipment. The detection principle of this system is dark-field microscopy. The performance of the system has been improved via model-based design. Through our model of the scattering process we identified two key components to improving...

Simultaneous AFM nano-patterning and imaging for photomask repair

In this paper we present a new AFM based nano-patterning technique that can be used for fast defect repairing of high resolution photomasks and possibly other high-speed nano-patterning applications. The proposed method works based on hammering the sample with tapping mode AFM followed by wet cleaning of the residuals. On the area where a...

Large dynamic range Atomic Force Microscope for overlay improvements

Nowadays most overlay metrology tools assess the overlay performance based on marker features which are deposited next to the functional device features within each layer of the semiconductor device. However, correct overlay of the relatively coarse marker features does not directly guarantee correct overlay of the much smaller device features....

EUV blank defect and particle inspection with high throughput immersion AFM with 1nm 3D resolution

Inspection of EUV mask substrates and blanks is demanding. We envision this is a good target application for massively parallel Atomic Force Microscopy (AFM). We envision to do a full surface characterization of EUV masks with AFM enabling 1nm true 3D resolution over the entire surface. The limiting factor to do this is in the sensor itself:...

Non-contact distance measurement and profilometry using thermal near-field radiation towards a high resolution inspection and metrology solution

Optical near-field technologies such as solid immersion lenses and hyperlenses are candidate solutions for high resolution and high throughput wafer inspection and metrology for the next technology nodes. Besides sub-diffraction limited optical performance, these concepts share the necessity of extreme proximity to the sample at distances that...

Demonstration of Parallel Scanning Probe Microscope for high throughput metrology and inspection

With the device dimensions moving towards the 1X node and below, the semiconductor industry is rapidly approaching the point where existing metrology, inspection and review tools face huge challenges in terms of resolution, the ability to resolve 3D and the throughput. Due to the advantages of sub-nanometer resolution and the ability of true 3D...

High-speed AFM for 1x node metrology and inspection: Does it damage the features?

This paper aims at unraveling the mystery of damage in high speed AFMs for 1X node and below. With the device dimensions moving towards the 1X node and below, the semiconductor industry is rapidly approaching the point where existing metrology, inspection and review tools face huge challenges in terms of resolution, the ability to resolve 3D,...

Transient Tip-Sample Interactions in High-Speed AFM Imaging of 3D nano structures

The maximum amount of repulsive force applied to the surface plays a very important role in damage of tip or sample in Atomic Force Microscopy(AFM). So far, many investigations have focused on peak repulsive forces in tapping mode AFM in steady state conditions. However, it is known that AFM could be more damaging in transient conditions. In...

High-throughput parallel SPM for metrology, defect and mask inspection

Scanning probe microscopy (SPM) is a promising candidate for accurate assessment of metrology and defects on wafers and masks, however it has traditionally been too slow for high-throughput applications, although recent developments have significantly pushed the speed of SPM [1,2]. In this paper we present new results obtained with our...

Parallel, Miniaturized Scanning Probe Microscope for Defect Inspection and Review

With the device dimensions moving towards the 1X node, the semiconductor industry is rapidly approaching the point where 10 nm defects become critical. Therefore, new methods for improving the yield are emerging, including inspection and review methods with sufficient resolution and throughput. Existing industrial tools cannot anymore fulfill...