The influence of hydrogen on the fatigue life of metallic leaf spring components in a vacuum environment

Hydrogen is used as a process gas in vacuum environments for semiconductor manufacturing equipment. If hydrogen dissolves in metallic components during operation it can result in hydrogen embrittlement. In order to assess if hydrogen embrittlement occurs in such a vacuum environment a special fatigue test has been developed. Accelerated life...

High speed bending of 2nd level interconnects on printed circuit boards for automotive electronics

Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic solder joint loading (sinus wave load, 10-200...