A combined experimental and theoretical study on the side ingress of water into barrier adhesives for organic electronics applications

This paper presents a thorough experimental and theoretical analysis of a model system for the mechanism of cathode degradation in OLED and OPV devices due to lateral side ingress of water vapour into laminated thin film barrier structures. The experimental procedure allows for full quantitative control over layer dimensions of the laminate, as...

Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods

Systems-in-foil technologies address the current need to manufacture low-cost, low-complexity and high-reliabiltiy large area organic electronics in the field of OLEDs, OPVs and sensors. For substrates with multiple layers of conductive tracks, there is a need to realize contact positions on either side of the foil. Unfortunately, typical...

Foil-to-foil lamination and electrical interconnection of printed components on flexible substrates

This paper describes and compares two integration methods to structurally laminate and interconnect foil-based components with flexible polymeric substrates. The first method uses isotropic conductive adhesives (ICA) confined in laser-ablated through foil vias (TFV), while the second one uses an anisotropic conductive adhesive (ACA). Both...

Capillary self-alignment dynamics for R2R manufacturing of mesoscopic system-in-foil devices

This paper reports a study on the dynamics of foil-based functional component self-alignment onto patterned test substrates and its demonstration when integrating a flexible sensor onto a printed circuitry. We investigate the dependence of alignment time and final precision of stacking of mm- and cm-sized foil dies on a number of system...

The OE-A OPV demonstrator anno domini 2011

Polymer solar cells were prepared in large numbers using roll-to-roll methods and were subsequently integrated into the Organic Electronics Association (OE-A) demonstrator in the year 2011 and presented as a small credit card sized lamp with a flat outline. The lamp comprised the polymer solar cell together with printed circuitry, discrete...

Flipchip bonding of ultrahin Si dies onto PEN/PET substrates with low cost circuitry

All-printed, cost effective, smart electronic products are expected to be used in a wide range of applications and in large quantities in our society. The substrate material for these applications will be low cost materials like PEN or PET foils. For the functionality of the printed electronics product it often will still be required to...