Searched for: author:"van Diesen-Tempelaars, K."
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Akkerman, H.B. (author), Pendayala, R. (author), Panditha, V.K.P. (author), Salem, A. (author), Shen, J. (author), van de Weijer, P. (author), Bouten, P.C.P. (author), Winter, S.H.P.M. (author), van Diesen-Tempelaars, K. (author), de Haas, G.J.A.J.F. (author), Steudel, S. (author), Huand, C. (author), Lai, M. (author), Huang, Y. (author), Yeh, M. (author), Kronemeijer, A.J. (author), Poodt, P. (author), Gelinck, G. (author)
We present a thin-film dual-layer bottom barrier on PI that is compatible with 350°C backplane processing for OLED displays. We demonstrate OLEDs that survive bending over 0.5 mm radius for 10.000x. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating AMOLED displays on GEN1-sized substrates.
conference paper 2018
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Akkerman, H.B. (author), Pendyala, R.K. (author), Panditha, P. (author), Salem, A. (author), Shen, J. (author), van de Weijer, P. (author), Bouten, P.C.P. (author), de Winter, S.H.P.M. (author), van Diesen-Tempelaars, K. (author), de Haas, G. (author), Steudel, S. (author), Huang, C.Y. (author), Lai, M.H. (author), Huang, Y.Y. (author), Yeh, M.H. (author), Kronemeijer, A.J. (author), Poodt, P. (author), Gelinck, G.H. (author)
We present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of <2 mm. We demonstrate organic light-emitting diodes that survive bending over 0.5...
article 2018
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van der Steen, J.L.P.J. (author), Tripathi, A.K. (author), Maas, J.P.V. (author), van Diesen-Tempelaars, K. (author), van Leuken, L.B. (author), de Haas, G.J.A.J.F. (author), van der Putten, J.B.P.H. (author), Yakimets, I. (author), Li, F.M.W. (author), Ellis, T.H. (author), van Mol, A.M.B. (author), Gelinck, G.H. (author), Vicca, P. (author), Smout, S. (author), Ameys, M. (author), Huei Ke, T. (author), Steudel, S. (author), Nag, M. (author), Schols, S. (author), Genoe, J. (author), Heremans, P. (author), Fukui, Y. (author), Green, S. (author)
We present a low-temperature metal oxide transistor backplane technology using PECVD dielectrics. We show successful integration of the backplane in flexible 200ppi AMOLED displays on ultrathin polymer films. The displays are encapsulated with a thin-film barrier and the total stack thickness is less than 150μm.
conference paper 2013