An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning...

Two-phase cooling of light emitting diode for higher light output and increased efficiency

High Power Light Emitting Diode (HP LED) is one of the promising candidates for future lighting systems with efficient energy consumption. However, around 70% of the input power will be still transferred to heat. Recently, to obtain more light output, the increased electrical currents consequently cause more significant heat. To solve the...

Advanced LED package with temperature sensors and microfluidic cooling

Light-emitting diodes (LEDs) are revolutionizing the illumination with energy savings and enhanced functionality. However, around 80% of the input power will be still transferred to heat. As the elevated temperature negatively affects the maximum light output, efficiency, quality, reliability and the lifetime of the SSL systems, thermal...

Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Mesoscale parameters, which describe the atomic interactions of the polymer-metal interface at the separation process, are important in the development of a coarse grain model for the interfacial adhesion study. A non-equilibrium molecular dynamics model is established to obtain the traction-displacement relations of the separation of epoxy...

The mechanical properties modeling of nano-scale materials by molecular dynamics

We propose a molecular modeling strategy which is capable of mod-eling the mechanical properties on nano-scale low-dielectric (low-k) materials. Such modeling strategy has been also validated by the bulking force of carbon nano tube (CNT). This modeling framework consists of model generation method, boundary condition setting and result...

Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module

The reliability assessment aspect of the LED field is not fully developed. The lack of complete understanding is due, in part, to the newness of the field. SSL has not existed long enough to directly gauge the accuracy of the Lifetime Assessments being made. The approach of using simulation in qualification to Lifetime Assessment is one of the...

Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

This paper demonstrates a heterogeneous integration of solid state lighting (SSL) module, including light source (LED) and driver/control components. Such integration has been realized by the polymer-based reconfigured wafer level package technologies and such structure has been prototyped and tested. The structure design, thermal design...

Evaluation and selection of sensing materials for carbon dioxide (CO 2) sensor by molecular modeling

We report a molecular modeling study to evaluate and select conducting polymers (CPs) as the sensing materials of carbon dioxide (CO2) sensor. The interaction between polymer and gas and the adsorption of the gas molecules in the polymer matrix are investigated. Polymers considered for this work include emeraldine base polyaniline (EB-PANI) and...

Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline

We report a molecular modelling study to validate the forcefields [condensed-phase optimised molecular potentials for atomistic simulation studies (COMPASS) and polymer-consistent forcefield (PCFF)] in predicting the physical and thermophysical properties of polymers. This work comprises of two key steps: (1) generating and validating the...

Overview on thermal and mechanical challenges of high power RF electronic packaging

High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital...

FE modeling of Cu wire bond process and reliability

Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to...

High power electronics package: From modeling to implementation

Power electronics, such as high power RF components and high power LEDs, requires the combination of robust and reliable package structures, materials, and processes to guarantee their functional performance and lifetime. We started with the thermal and thermal-mechanical modeling of such component performances. With robust validation....

LED system reliability

This paper presents our effort to predict the system reliability of Solid State Lighting (SSL) applications. A SSL system is composed of a LED engine with micro-electronic driver(s) that supplies power to the optic design. Knowledge of system level reliability is not only a challenging scientific exercise but it is also crucial for successful...

Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting

The increased electrical currents used to drive light emitting diode (LED) cause significant heat generation in the solid state lighting (SSL) system. As the temperature will directly affect the maximum light output, quality, reliability and the life time of the SSL system, thermal management is a key design aspect in terms of cost and...

Forcefields based molecular modeling on the mechanical and physical properties of emeraldine base polyaniline

Molecular dynamics (MD) and molecular mechanical (MM) analysis are carried out to provide reliable and accurate model for emeraldine base polyaniline. This study validate the forcefields and model with the physical and mechanical properties of the polyaniline. The temperature effects on non-bond energy, potential energy and solubility parameter...