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Perpiñà, X. (author), Werkhoven, R.J. (author), Vellvehi, M. (author), Jakovenko, J. (author), Jordà, X. (author), Kunen, J.M.G. (author), Bancken, P. (author), Bolt, P.J. (author)This paper studies the thermal influence of a light-emitting diode (LED) driver on a retrofit LED lamp, also reporting on a procedure for its thermal characterization and multiscale modeling. In this analysis, temperature is measured by infrared thermography and monitoring specific locations with thermocouples. Experimental results point out...article 2015
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den Bakker, A.J. (author), Werkhoven, R.J. (author), Sillekens, W.H. (author), Katgerman, L. (author)Longitudinal weld seams are an intrinsic feature in hollow extrusions produced with porthole dies. As these joins occur along the entire extruded length, it is desirable that these weld seams have a minimal impact on the structural integrity of the extrudate. In particular, defects associated with weld seam formation should be avoided. In this...article 2014
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Ghosh, M. (author), Miroux, A. (author), Werkhoven, R.J. (author), Bolt, P.J. (author), Kestens, L.A.I. (author)The increasing use of aluminium alloys in light weight structural applications is restricted mainly due to their lower room temperature formability compared to steels. Forming at higher temperature is seen as a promising solution to this problem. In the present investigation two Al-Mg-Si alloys (EN AW-6016 and EN AW-6061) were deep-drawn at room...article 2014
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Vellvehi, M. (author), Perpina, X. (author), Jorda, X. (author), Werkhoven, R.J. (author), Kunen, J.M.G. (author), Jakovenko, J. (author), Bancken, P. (author), Bolt, P.J. (author)This work deals with the extraction of key thermal parameters for accurate thermal modelling of LED lamps: air exchange coefficient around the lamp, emissivity and thermal conductivity of all lamp parts. As a case study, an 8W retrofit lamp is presented. To assess simulation results, temperature is monitored on the lamp by infrared thermography...conference paper 2013
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Pardo, B. (author), Gasse, A. (author), Fargeix, A. (author), Jakovenko, J. (author), Werkhoven, R.J. (author), Perpiñà, X. (author), Jordà, X. (author), Vellhevi, M. (author), van Weelden, T. (author), Bancken, P. (author)In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys® software and thermal measurements have been carried out using the forward voltage method to...article 2013
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Jakovenko, J. (author), Formánek, J. (author), Perpiñà, X. (author), Jorda, X. (author), Vellvehi, M. (author), Werkhoven, R.J. (author), Husák, M. (author), Kunen, J.M.G. (author), Bancken, P. (author), Bolt, P.J. (author), Gasse, A. (author)This work presents a comparison of various LED board technologies from thermal, mechanical and reliability point of view provided by an accurate 3-D modelling. LED boards are proposed as a possible technology replacement of FR4 LED boards used in 400 lumen retrofit SSL lamps. Presented design methodology can be used for other high power SSL lamp...article 2013
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Jakovenko, J. (author), Formánek, J. (author), Pardo, B. (author), Perpiñà, X. (author), Werkhoven, R.J. (author), Kunen, J.M.G. (author), Bancken, P. (author), Bolt, P.J. (author)This work deals with a precise 3-D modelling of several LED board technologies mainly focused on thermal, thermo-mechanical evaluation and life time prediction to compare their performances. Main role of each LED board is to transport heat from LED die to heat sink and keep the thermal stresses in all layers as low as possible. Thermal stress...conference paper 2012
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Jakovenko, J. (author), Formánek, J. (author), Vladimír, J. (author), Husák, M. (author), Werkhoven, R.J. (author)Thermal and thermo-mechanical modeling and characterization of solid state lightening (SSL) retrofit LED Lamp are presented in this paper. Paramount Importance is to design SSL lamps for reliability, in which thermal and thermo-mechanical aspects are key points. The main goal is to get a precise 3D thermal lamp model for further thermal...article 2012
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Perpiñà, X. (author), Werkhoven, R.J. (author), Vellvehi, M. (author), Jordà, X. (author), Kunen, J.M.G. (author), Jakovenko, J. (author), Bancken, P. (author), Bolt, P.J. (author)This paper summarizes a study into the thermal influence of an LED driver board on an SSL Lamp. Full thermal characterization of an LED lamp and driver board is carried out by infrared thermography and by monitoring specific locations with thermocouples. The experimental results have been used to set up and validate a predictive simulation model...conference paper 2012
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Bullema, J.E. (author), Werkhoven, R.J. (author), Gielen, A.W.J. (author), Kunen, J.M.G. (author), Hesen, P. (author), Swartjes, F.H.M. (author), Boschman, F. (author)Intelligent LED lighting systems can save up to 80% of energy compared to incandescent lighting systems. In order to provide these products at reasonable costs, integration and miniaturization are important steps [1]. Another attractive feature of LED systems is the claimed long life expectancy. The design lifetime of LED luminaries is typically...conference paper 2012
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Perpiñà, X. (author), Werkhoven, R.J. (author), Jakovenko, J. (author), Formánek, J. (author), Vellvehi, M. (author), Jordà, X. (author), Kunen, J.M.G. (author), Bancken, P. (author), Bolt, P.J. (author)This work presents a methodology to design an SSL system for reliability. An LED lamp is thermally characterised and its model thermally simulated, indicating that the LED board (FR4 board with thermal vias, copper tracks and LED package) is the thermally most stressed part. Therefore, a thermo-mechanical analysis is performed from a detailed...article 2012
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Werkhoven, R.J. (author), Sillekens, W.H. (author), van Lieshout, J.B.J.M. (author)Biomedical applications are an emerging field of interest for magnesium technology, envisioning biodegradable implants that resorb in the human body after having cured a particular medical condition (such as artery clogging or bone fractures). This challenges research in a sense that the materials to be used need to dissolve in vivo in a...conference paper 2011
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Jakovenko, J. (author), Werkhoven, R.J. (author), Formánek, J. (author), Kunen, J.M.G. (author), Bolt, P.J. (author), Kulha, P. (author)This work deals with thermal simulation and characterization of solid state lightening (SSL) LED Lamp in order to get precise 3D thermal models for further lamp thermal optimization. Simulations are performed with ANSYS-CFX and CoventorWare software tools. The simulated thermal distribution has been validated with thermal measurement on a...conference paper 2011
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Gielen, A.W.J. (author), Hesen, P. (author), Swartjes, F.H.M. (author), van Zeijl, H. (author), Boschman, F. (author), Bullema, J.-E. (author), Werkhoven, R.J. (author), Koh, S. (author)Intelligent LED lighting systems can save up to 80% of energy compared to traditional lighting systems. In order to provide these intelligent lighting products at reaseonable costs, integration and miniaturisation are important steps. To this end we have designed a LED system-in-package that combines LEDs, driver ICs, and passives into a single...conference paper 2011
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de Rooij, M.B. (author), Ma, X. (author), den Bakker, A.J. (author), Werkhoven, R.J. (author)The surface quality of aluminium extrusion products can be hampered by undesired surface features like die lines and pickups. In particular the presence of pickups is considered as undesirable. Surface pickups appear as intermittent torn marks on the aluminium extrusion products, often terminated with a protruding lump rising above the surface...conference paper 2011
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Ye, H. (author), Gielen, A.W.J. (author), van Zeijl, H.W. (author), Werkhoven, R.J. (author), Zhang, G.Q. (author)The increased electrical currents used to drive light emitting diode (LED) cause significant heat generation in the solid state lighting (SSL) system. As the temperature will directly affect the maximum light output, quality, reliability and the life time of the SSL system, thermal management is a key design aspect in terms of cost and...conference paper 2011
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- Erinc, M. (author), van de Wiel, H.J. (author), Werkhoven, R.J. (author), Pongrácz, A. (author), Battistig, G. (author), Fischer, H.R. (author) conference paper 2011
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den Bakker, A.J. (author), Werkhoven, R.J. (author), Sillekens, W.H. (author), Katgerman, L. (author), TNO Industrie en Techniek (author)Longitudinal weld seams are an intrinsic feature in hollow extrusions produced with porthole dies. The formation of longitudinal weld seams is a solid bonding process, controlled by the local conditions in the extrusion die. Being the weakest areas within the extrusion cross section, it is desirable to achieve adequate properties of these weld...conference paper 2010
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den Bakker, A.J. (author), Werkhoven, R.J. (author), Sillekens, W.H. (author), Katgerman, L. (author)In hollow aluminium extrusions produced with porthole dies, longitudinal weld-seams are present throughout the entire extruded length, due to rejoining of metal streams inside the extrusion tooling. These weld-seams, formed by a solid-state bonding process at elevated temperatures and under conditions of interfacial pressure and plastic...conference paper 2010
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den Bakker, A.J. (author), Werkhoven, R.J. (author), Sillekens, W.H. (author), Katgerman, L. (author)In hollow aluminium extrusions, longitudinal weld-seams are formed through a solid-state bonding process at elevated temperatures and under conditions of interfacial pressure and plastic deformation. For structurally loaded components, sound weld seams are imperative. In our research, a weld seam integrity indicator as a means of quantifying...conference paper 2010
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