Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods

Systems-in-foil technologies address the current need to manufacture low-cost, low-complexity and high-reliabiltiy large area organic electronics in the field of OLEDs, OPVs and sensors. For substrates with multiple layers of conductive tracks, there is a need to realize contact positions on either side of the foil. Unfortunately, typical...

Novel interconnection processes for low cost PEN/PET substrates

Recently a new class of flexible electronics is starting to emerge which is most effectively termed 'printed electronics'. This term often refers to all-printed, cost effective, smart electronic products that will find a wide range of applications in large quantities in our society. The substrate material for these applications will be low cost...

A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources

A study on via drilling and channel scribing on PEN and PET substrates for flexible electronic application is discussed in this paper. For the experiments, both KIF excimer laser (248 nm) and frequency tripled Nd:YAG (355 nm) laser are used. Different measurement techniques like optical microscopy, Dektak profilometer, Confocal microscopy and...

Flipchip bonding of Si chip on flexible PEN foil using novel electronic 100 m pitch fan-out circuitry

A novel, cost effective technology to manufacture high density embedded electronic circuitry is demonstrated. The process consists of laser photoablation of the circuitry into a substrate through a mask and subsequent filling using a polymer thick film paste. Because the volume of the substrate is used it is possible to make thick and thereby...