Searched for: author%3A%22Piras%2C+D.%22
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Quesson, B.A.J. (author), van Neer, P.L.M.J. (author), Tamer, M.S. (author), Hatakeyama, K. (author), van Es, M.H. (author), van Riel, M.C.J.M. (author), Piras, D. (author)
The semiconductor industry needs to fit ever more devices per unit area to improve their performance; hence a trend towards increasingly complex structures by varying material combinations and 3D geometries with increasing aspect ratios. The new materials used may be optically opaque, posing problems for traditional optical metrology methods....
conference paper 2022
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van Neer, P.L.M.J. (author), Quesson, B.A.J. (author), Tamer, M.S. (author), Hatakeyama, K. (author), van Es, M.H. (author), van Riel, M.C.J.M. (author), Piras, D. (author)
Several methods are being researched to detect and characterize buried nanoscale structures in hard solid samples. The most common acoustic method is acoustic microscopy. An acoustic microscope is based on a single element transducer operating in pulse-echo mode. The acoustic waves are coupled into a sample using a liquid couplant (eg water) and...
article 2021
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Piras, D. (author), van Neer, P.L.M.J. (author), Thijssen, R.M.T. (author), Sadeghian, H. (author)
article 2020
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van Es, M.H. (author), Mohtashami, A. (author), Piras, D. (author), Hatakeyama, K. (author), Quesson, B.A.J. (author), Fillinger, L. (author), Neer, P.L.M.J. (author)
While Atomic Force Microscopy is mostly used to investigate surface properties, people have almost since its invention sought to apply its high resolution capability to image also structures buried within samples. One of the earliest techniques for this was based on using ultrasound excitations to visualize local differences in effective tip...
article 2020
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van Es, M.H. (author), Quesson, B.A.J. (author), Mohtashami, A. (author), Piras, D. (author), Hatakeyama, K. (author), Fillinger, L. (author), van Neer, P.L.M.J. (author)
In order to extract ever more performance from semiconductor devices on the same device area, the semiconductor industry is moving towards device structures with increasingly complex material combinations and 3D geometries. To ensure cost effective fabrication of next generation devices, metrology solutions are needed that tackle the specific...
conference paper 2020
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Quesson, B.A.J. (author), van Neer, P.L.M.J. (author), Es, M. (author), M.H. van, (author), Piras, D. (author), Hatakeyama, K. (author), Mohtashami, A. (author), van der Lans, M.J. (author)
In Subsurface Scanning Probe Microscopy (SSPM), Atomic Force Microscopy (AFM) is combined with ultrasound. The AFM cantilever is used as a receiver. At low frequencies (O(MHz)) the method can be used to measure the stiffness contrast in a sample and at high frequencies (O(GHz)) to measure scattering based contrast. Both variants use modulated...
conference paper 2020
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van Es, M.H. (author), Quesson, B.A.J. (author), Mohtashami, A. (author), Piras, D. (author), Hatakeyama, K. (author), Fillinger, L. (author), van Neer, P.L.M.J. (author)
In order to extract ever more performance from semiconductor devices on the same device area, the semiconductor industry is moving towards device structures with increasingly complex material combinations and 3D geometries. To ensure cost effective fabrication of next generation devices, metrology solutions are needed that tackle the specific...
conference paper 2020
document
van Neer, P.M.L.J. (author), Quesson, B.A.J. (author), van Es, M.H. (author), van Riel, M.C.J.M. (author), Hatakeyama, K. (author), Mohtashami, A. (author), Piras, D. (author), Duivenvoorde, T. (author), van der Lans, M.J. (author), Sadeghian Marnani, H. (author)
The characterization of buried nanoscale structures nondestructively is an important challenge in a number of applications, such as defect detection and metrology in the semiconductor industry. A promising technique is Subsurface Scanning Probe Microscopy (SSPM), which combines ultrasound with Atomic Force Microscopy (AFM). Initially, SSPM was...
article 2019
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Tronci, S. (author), van Neer, P.L.M.J. (author), Giling, E.J.M. (author), Stelwagen, U. (author), Piras, D. (author), Mei, R. (author), Corominas, F. (author), Grosso, M. (author)
article 2019
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Koek, W.D. (author), van Zwet, E.J. (author), Plissi, M. (author), Eschen, M. (author), Piras, D. (author), van Neer, P.L.M.J. (author), van der Lans, M.J. (author)
We have developed a photo thermal acoustic imaging (PTAI)setup and have applied it for the characterization of sub surface features composed of materials which are commonly used in the semiconductor industry. Photo thermal acoustic imaging (PTAI) is a measurement technique that combines the practical advantages of an optical technique (non...
other 2019
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van Neer, P.L.M.J. (author), van Es, M.H. (author), Piras, D. (author), Navarro, V. (author), Mohtashami, A. (author), van der Lans, M.J. (author), Sadeghian Marnani, H. (author)
This work details the initial simulation and experimental GHz SPM work carried out at TNO.
other 2019
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Rajadurai, S.R.S. (author), Piras, D. (author), Hatakeyama, K. (author), van Neer, P.L.M.J. (author), van Es, M.H. (author), van der Lans, M.J. (author)
This technique uses an Atomic force microscope (AFM) to map the elastic properties of buried materials with high spatial resolution. Ultrasound excitation is applied to the tip-sample interface in the AFM, while the probe’s dynamic response is monitored. The excitation is a carrier of high frequency fc, that is amplitude-modulated at a lower...
other 2019
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Piras, D. (author), Fillinger, L. (author), Rajadurai, S.R.S. (author), van Es, M.H. (author), van der Lans, M.J. (author)
In order to make stiffness based subsurface AFM a quantitative imaging modality, the experimental subsurface measurement must be interpreted with a versatile forward (and inverse) model. We have developed a fully parametric finite element model framework for the quantification of critical dimensions relevant in semicon applications. After...
other 2019
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van Neer, P.L.M.J. (author), Quesson, B.A.J. (author), van Es, M.H. (author), Piras, D. (author), van der Lans, M.J. (author)
GOAL: investigate feasibility of top actuated scattering based SSPM using simulations.
other 2019
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van Neer, P.L.M.J. (author), Stelwagen, U. (author), Geers, L.F.G. (author), Piras, D. (author), Corominas, F. (author), Grosso, M. (author), Giling, E.J.M. (author)
The number of chemical processes transferred from a batch-wise approach to continuous flow is increasing, due
conference paper 2018
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van Es, M.H. (author), Mohtashami, A. (author), Thijssen, R.M.T. (author), Piras, D. (author), van Neer, P.L.M.J. (author), Sadeghian, H. (author)
Nondestructive subsurface nanoimaging of buried nanostructures is considered to be extremely challeng- ing and is essential for the reliable manufacturing of nanotechnology products such as three-dimensional (3D) transistors, 3D NAND memory, and future quantum electronics. In scanning probe microscopy (SPM), a microcantilever with a sharp tip...
article 2018
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van Es, M.H. (author), Mohtashami, A. (author), Piras, D. (author), Sadeghian Marnani, H. (author)
Nondestructive subsurface nanoimaging through optically opaque media is considered to be extremely challenging and is essential for several semiconductor metrology applications including overlay and alignment and buried void and defect characterization. The current key challenge in overlay and alignment is the measurement of targets that are...
conference paper 2018
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Navarro, V. (author), Mohtashami, A. (author), Herfst, R.W. (author), Maturova, K. (author), van Es, M.H. (author), Piras, D. (author), Sadeghian Marnani, H. (author)
As the pitch approaches the 10nm node, in order to meet current and future patterning challenges, high resolution techniques are required, complementary to extreme ultraviolet lithography (EUVL) for high volume manufacturing of nanodevices. These complementary techniques should have the following specifications: 1) High patterning resolution,...
conference paper 2018
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Quesson, B.A.J. (author), van Neer, P.L.M.J. (author), van Riel, M.C.J.M. (author), van Es, M.H. (author), Piras, D. (author), Hatakeyama, K. (author), Mohtashami, A. (author), Navarro, V. (author), Duivenvoorde, T. (author), Sadeghian Marnani, H. (author)
Many techniques are under development for the detection of subsurface defects or cracks. One such method is GHz subsurface probe microscopy (GHz SSPM). Here, modulated GHz elastic waves are transmitted through the bottom of a sample. The waves are scattered by buried features and detected using the probe of an atomic force microscope (AFM),...
conference paper 2018
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van Neer, P.L.M.J. (author), Piras, D. (author), Koek, W. (author), van Zwet, E. (author), Sadeghian, H. (author)
conference paper 2017
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