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Chakkalakkal Abdulla, S.M.C. (author), de Boer, B.M. (author), Pozo Torres, J.M. (author), van den Berg, J.H. (author), Abutan, A.E. (author), Hagen, R.A.J. (author), Lo Cascio, D.M.R. (author), Harmsma, P.J. (author)This article presents work on a Silicon-On-Insulator (SOI) compact sensing platform based on Micro Ring Resonators (MRRs). In order to enable correction for variations in environmental conditions (temperature, mechanical stress etc), a study has been performed on the performance of uncoated sensing MRRs, and of SU8- and SiO2-covered reference...conference paper 2014
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Khanna, A. (author), Drissi, Y. (author), Dumon, P. (author), Baets, R. (author), Absil, P. (author), Pozo Torres, J.M. (author), Lo Cascio, D.M.R. (author), Fournier, M. (author), Fedeli, J.M. (author), Fulbert, L. (author), Zimmermann, L. (author), Tillack, B. (author), Aalto, T. (author), O'Brien, P. (author), Deptuck, D. (author), Xu, J. (author), Gale, D. (author)ePIXfab-The European Silicon Photonics Support Center continues to provide state-of-the-art silicon photonics solutions to academia and industry for prototyping and research. ePIXfab is a consortium of EU research centers providing diverse expertise in the silicon photonics food chain, from training users in designing silicon photonics chips to...conference paper 2013
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Pozo Torres, J.M. (author), Kumar, P. (author), Lo Cascio, D.M.R. (author), Khanna, A. (author), Dumon, P. (author), Delbeke, D. (author), Baets, R. (author), Fournier, M. (author), Fedeli, J.-M. (author), Fulbert, L. (author), Zimmermann, L. (author), Tillack, B. (author), Tian, H. (author), Aalto, T. (author), O'Brien, P. (author), Deptuck, D. (author), Xu, J. (author), Zhang, X. (author), Gale, D. (author)ePIXfab brings silicon photonics within reach of European small and medium sized enterprises, thereby building on its track record and its integration into Europractice. To this end, ePIXfab offers affordable access to standardized active and passive silicon photonic IC and packaging technology, a path from design to manufacturing and hands-on...conference paper 2012
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- Harmsma, P.J. (author), Cheng, L.K. (author), Lo Cascio, D.M.R. (author), Yousefi, M. (author) conference paper 2011
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Harmsma, P. (author), Staats, J.P. (author), Lo Cascio, D.M.R. (author), Cheng, L.K. (author)The wavelength of a narrow-band optical signal can be accurately tracked by means of an interferometer having a fixed path length difference. For example, a low-cost Fiber Bragg Grating (FBG) interrogation system which tracks the FBG reflection wavelength over time can be based on such an interferometer. Alternatively, an interferometer is...conference paper 2011
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Pozo Torres, J.M. (author), Westerveld, W. (author), Harmsma, P.J. (author), Yang, S. (author), Bodis, P. (author), Nieuwland, R. (author), Lagioia, M. (author), Lo Cascio, D.M.R. (author), Staats, J. (author), Schmits, R. (author), Berg, H.V.D. (author), Tabak, E. (author), Green, K. (author), Urbach, H.P. (author), Cheng, L.K. (author), Yousefi, M. (author)In this paper, we present two examples of photonic sensors based on ring resonators in Silicon-on-Insulator (SOI) waveguide technology as mass production compatible sensing units for the measurement of: strain, and ultrasound. Furthermore, the sensing units are characterized in extreme conditions to validate their robustness in harsh industrial...conference paper 2011
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Staats, J.P. (author), Harmsma, P.J. (author), Cheng, L.K. (author), Lo Cascio, D.M.R. (author), Yousefi, M. (author), TNO Industrie en Techniek (author)The interferometer based on the fiber 3x3 coupler is already a well-known device for measuring displacements and wavelength shifts. TNO is currently working on the fabrication of an integrated version of this versatile interferometer on Silicon-On-Insulator. The integrated interferometer is expected to be far more stable then the fiber version,...conference paper 2010
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Rijnveld, N. (author), van der Neut, F.J.A. (author), Harmsma, P.J. (author), Lo Cascio, D.M.R. (author), Yousefi, M. (author), TNO Industrie en Techniek (author)Coupling an optical chip to its surroundings is very hard compared to an electrical chip. This complexity is mainly caused by alignment and accuracy challenges and is driving the cost price up to levels at which the commercial benefits of optical chips are no longer obvious, despite their many great technological advantages. Up to 80% of an...conference paper 2010
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- van Zeijl, E. (author), Schmits, R. (author), van den Berg, J.H. (author), Harmsma, P.J. (author), Westerveld, W.J. (author), Lagioia, M. (author), Bodis, P. (author), Ebeling, R.P. (author), Nieuwland, R.A. (author), Yang, S. (author), Lo Cascio, D.M.R. (author), Agovic, K. (author), Enderink, E.J. (author), van Vliet, R.E. (author), Yousefi, M. (author), TNO Industrie en Techniek (author) conference paper 2010
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- Westerveld, W.J. (author), Harmsma, P.J. (author), Schmits, R. (author), Lo Cascio, D.M.R. (author), Duisterwinkel, A.E. (author), Agovic, K. (author), van Vliet, R.E. (author), Urbach, H.P. (author), Yousefi, M. (author), TNO Industrie en Techniek (author) conference paper 2010
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- Lo Cascio, D.M.R. (author), Huijser, W. (author), TNO Milieu Energie en Procesinnovatie (author) report 2001