Highly Efficient and Stable Rigid Perovskite/Si and Flexible Perovskite/CIGS 4-Terminal Tandems

In this work, efficient rigid and flexible semi-transparent perovskite solar cells (ST-PSCs) were prepared in inverted (light incidence through hole transport layer) configuration. All layers were deposited by a combination of low-temperature solution-based, sputtering and spatial atomic layer deposition (sALD) techniques, which can be...

Towards Large Area Stable Perovskite Solar Cells and Modules

In order to commercialize the perovskite solar cells (PSC) technology, efficient and industrial deposition methods over large areas have to be adopted, and the device architectures have to provide long term stability. In this work we combine several upscalable deposition methods to develop a stable semitransparent PSC. The control of the...

Stable and highly transparent Perovskite cell and module for high efficiency Perovskite/c Si 4-terminal tandems

The purpose of the work is to investigate high-efficient and stable 4-terminal perovskite/c-Si tandem devices. Hybrid tandems of c-Si bottom cells and perovskite top cells are perhaps the most promising candidates to reduce the levelized cost of electricity by increasing the overall tandem cell efficiency. To turn this promise in a commercial...

Stable and highly transparent perovskite cells and modules for high efficiency perovskite/c-Si 4-thermal tandems

Large area 140 cm2 perovskite solar modules made by sheet to sheet and roll to roll fabrication with 14.5% efficiency

The industrialization of perovskite solar cells (PSC) require processes to efficiently deposit the constituent layers over large areas. In this work we optimized the use of slot die coating process for both sheet-to-sheet (S2S) and roll-to-roll (R2R) manufacturing. Particular focus have been put on the control of the uniformity of perovskite...

Surface Fluorination of ALD TiO2 Electron Transport Layer for Efficient Planar Perovskite Solar Cells

Perovskite solar cells (PSCs) are emerging among the photovoltaic (PV) technologies due to their high power conversion efficiency (PCE) in combination with potentially low cost manufacturing processing. In this contribution, the fabrication of efficient planar n-i-p PSCs by the modification of the electron transport layer (ETL) adopted as n-type...

Up-scaling perovskite solar cell manufacturing from sheet-to-sheet to roll-to-roll: Challenges and solutions

Organometallic halide perovskite solar cells (PSCs) are extremely promising novel materials for thin-film photovoltaics, exhibiting efficiencies over 22% on glass and over 17% on foil 1, 2. First, a sheet-to-sheet (S2S) production of PSCs and modules on 152x152 mm2 substrates was established, using a combination of sputtering, e-beam evaporation...

An Indium-Free Anode for Large-Area Flexible OLEDs: Defect-Free Transparent Conductive Zinc Tin Oxide

Flexible large-area organic light-emitting diodes (OLEDs) require highly conductive and transparent anodes for efficient and uniform light emission. Tin-doped indium oxide (ITO) is the standard anode in industry. However, due to the scarcity of indium, alternative anodes that eliminate its use are highly desired. Here an indium-free anode is...

Electronic device and method of manufacturing an electronic device

An electronic device comprising at least one die stack having at least a first die (D1) comprising a first array of light emitting units (OLED) for emitting light, a second layer (D2) comprising a second array of via holes (VH) and a third die (D3) comprising a third array of light detecting units (PD) for detecting light from the first array of...

Electronic device and method of manufacturing an electronic device

An electronic device comprising at least one die stack having at least a first die (D1) comprising a first array of light emitting units (OLED) for emitting light, a second layer (D2) comprising a second array of via holes (VH) and a third die (D3) comprising a third array of light detecting units (PD) for detecting light from the first array of...

Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections

ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal...

Method of manufacturing a display device

ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal...