Searched for: author%3A%22Kouters%2C+M.H.M.%22
(1 - 9 of 9)
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Kouters, M.H.M. (author), Slot, H.M. (author), van Zwieten, W. (author), van der Veer, J. (author)
Hydrogen is used as a process gas in vacuum environments for semiconductor manufacturing equipment. If hydrogen dissolves in metallic components during operation it can result in hydrogen embrittlement. In order to assess if hydrogen embrittlement occurs in such a vacuum environment a special fatigue test has been developed. Accelerated life...
article 2014
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Kouters, M.H.M. (author), Gubbels, G.H.M. (author), Dos Santos Ferreira, O. (author)
article 2013
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van de Wiel, H.J. (author), Vard√ły, A.S.B. (author), Hayes, G. (author), Kouters, M.H.M. (author), van der Waal, A. (author), Erinc, M. (author), Lapadatu, A. (author), Martinsen, S. (author), Taklo, M.M.V. (author), Fischer, H.R. (author)
Hermetic wafer-level encapsulation of atmosphere sensitive Micro-Electric-Mechanical Systems (MEMS) devices is vital to achieve a high yield, a high performance and a long operating lifetime. An interesting and gradually more employed packaging technique is flux-less wafer-level copper-tin (Cu-Sn) solid-liquid interdiffusion (SLID) bonding. The...
conference paper 2013
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Gubbels, G.H.M. (author), Kouters, M.H.M. (author), Dos Santos Ferreira, O. (author)
In high power automotive electronics copper wire bonding is regarded as the most promising alternative for gold wire bonding in 1st level interconnects. In the Cu-Al ball bond interface the growth of intermetallic compounds can deteriorate the electrical and mechanical properties of the interconnection. A summary of the thermo-mechanical...
conference paper 2012
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Kouters, M.H.M. (author), Gubbels, G.H.M. (author), Yuan, C.A. (author)
conference paper 2012
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Kouters, M.H.M. (author), Gubbels, G.H.M. (author), O'Halloran, O. (author), Rongen, R. (author), Weltevreden, E.R. (author)
In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the wire bond. The thermo-mechanical properties of...
conference paper 2011
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Kouters, M.H.M. (author), Gubbels, G.H.M. (author), O'Halloran, O. (author), Rongen, R. (author)
In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1 st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the electrical, thermal and mechanical properties....
conference paper 2011
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Kouters, M.H.M. (author), Ubachs, R. (author), van de Wiel, H.J. (author), van der Waal, A. (author), van der Veer, J. (author)
Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic solder joint loading (sinus wave load, 10-200...
conference paper 2011
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Gubbels, G.H.M. (author), Kouters, M.H.M. (author), O'Halloran, O. (author), Rongen, R. (author), TNO Industrie en Techniek (author)
To mimic the growth of intermetallic compounds during and after copper ball bonding, diffusion couples of aluminum and copper were made, annealed at high temperature and chemically analyzed. Two types of couples were investigated: 1) a piece of copper and of aluminum in mechanical contact at a specified temperature 2) a galvanic deposited layer...
conference paper 2010
Searched for: author%3A%22Kouters%2C+M.H.M.%22
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