The influence of hydrogen on the fatigue life of metallic leaf spring components in a vacuum environment

Hydrogen is used as a process gas in vacuum environments for semiconductor manufacturing equipment. If hydrogen dissolves in metallic components during operation it can result in hydrogen embrittlement. In order to assess if hydrogen embrittlement occurs in such a vacuum environment a special fatigue test has been developed. Accelerated life...

Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, interface delamination and thermal conductivity

Systematic characterization of key parameters of hermetic wafer-level Cu-Sn SLID bonding

Hermetic wafer-level encapsulation of atmosphere sensitive Micro-Electric-Mechanical Systems (MEMS) devices is vital to achieve a high yield, a high performance and a long operating lifetime. An interesting and gradually more employed packaging technique is flux-less wafer-level copper-tin (Cu-Sn) solid-liquid interdiffusion (SLID) bonding. The...

Characterization of intermetallic compounds in Cu-Al ball bonds: Thermo-mechanical properties, interface delamination and corrosion

In high power automotive electronics copper wire bonding is regarded as the most promising alternative for gold wire bonding in 1st level interconnects. In the Cu-Al ball bond interface the growth of intermetallic compounds can deteriorate the electrical and mechanical properties of the interconnection. A summary of the thermo-mechanical...

Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, delamination strength and thermal conductivity

Mechanical properties of intermetallics formed during thermal aging of Cu-Al ball bonds

In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the wire bond. The thermo-mechanical properties of...

Characterization of intermetallic compounds in Cu-Al ball bonds: Layer growth, mechanical properties and oxidation

In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1 st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the electrical, thermal and mechanical properties....

High speed bending of 2nd level interconnects on printed circuit boards for automotive electronics

Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic solder joint loading (sinus wave load, 10-200...

Growth and properties of intermetallics formed during thermal aging of Cu-Al ball bonds

To mimic the growth of intermetallic compounds during and after copper ball bonding, diffusion couples of aluminum and copper were made, annealed at high temperature and chemically analyzed. Two types of couples were investigated: 1) a piece of copper and of aluminum in mechanical contact at a specified temperature 2) a galvanic deposited layer...