3D Printed Electronics using SLA for high resolution and throughput

Naar een slimme aanpak voor scholenbouw in Noord-Nederland

Gemeenten en schoolbersturen in Noord-Nederland hebben de kans om het scholenbestand een kwaliteitsimpuls te geven. Aantrekkelijke scholen bouwen die duurzaam, aardbevings- en toekomstbestendig zijn. De aardbevingen problematiek heeft gezorgd voor fondsen en momentum. Het is nu de uitdaging om deze kans maximaal te benutten

In-Line Resistance and Temperature Measurement of Conductive Inks

The necessary metal-based inks typically consist of silver nanoparticles dispersed in a liquid carrier medium. In order to keep the ink stable and printable, the agglomeration and sedimentation of these functional components need to be prevented as long as they are not printed onto a substrate. This is typically done by the addition of organic ...

Conductivity Enhancement of Binder-Based Graphene Inks by Photonic Annealing and Subsequent Compression Rolling

This paper describes a combination of photonic annealing and compression rolling to improve the conductive properties of printed binder-based graphene inks. High-density light pulses result in temperatures up to 500 °C that along with a decrease of resistivity lead to layer expansion. The structural integrity of the printed layers is restored...

Hybrid integration on low-cost flex foils using photonic flash soldiering

Soldering of packaged electronic components using industry standard Sn-Ag-Cu (SAC) lead-free solders on low-cost foils, which are often the substrate of choice for flexible electronics, is challenging. This is mainly originating from the fact that the reflow temperatures of these solder alloys are normally higher than the maximum processing...

A benchmark study of commercially available copper nanoparticle inks for application in organic electronic devices

A set of three commercial copper nanoparticle based inkjet inks has been benchmarked with respect to their potential to form conducting printed structures for future applications in organic electronic devices. Significant differences were observed in terms of jetting properties, spreading behaviour and line formation on a number of relevant...

Large area photonic flash soldering of thin chips on flex foils for flexible electronic systems: In situ temperature measurements and thermal modelling

In this work photonic energy from a high power xenon flash lamp is used for soldering thin chips on polyimide and polyester foil substrates using standard Sn-Ag-Cu lead free alloys. The absorption of the xenon light pulse leads to rapid heating of components and tracks up to temperatures above the solder melting temperature, while the...

Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using a lead-free solder...

Photonic flash sintering of silver nanoparticle inks: A fast and convenient method for the preparation of highly conductive structures on foil

Silver nanoparticle inks printed on temperature-sensitive substrates can be converted into structures with high electrical conductivities within fractions of a second by photonic flash sintering. The key principle is the selective heating of the ink by the absorption of strongly focused pulsed light for which the substrate is transparent. The...

How to set up and manage quality control and quality assurance

This document provides a general introduction to clarify the differences between quality control (QC) and quality assurance (QA). In addition it serves as a starting point for implementing a quality system approach within an organization. The paper offers practical guidance to the implementation of quality and the importance of QC in its...