Mode I and II fracture toughness testing of interleaves for ballistic impact

An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning...