Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, interface delamination and thermal conductivity

Characterization of intermetallic compounds in Cu-Al ball bonds: Thermo-mechanical properties, interface delamination and corrosion

In high power automotive electronics copper wire bonding is regarded as the most promising alternative for gold wire bonding in 1st level interconnects. In the Cu-Al ball bond interface the growth of intermetallic compounds can deteriorate the electrical and mechanical properties of the interconnection. A summary of the thermo-mechanical...

Adhesion experiments using an AFM-Parameters of influence

Adhesion measurements were performed by AFM (Atomic Force Microscopy). It was shown that many parameters need to be controlled in order to provide reproducible and quantitative results. Adhesion forces were shown to depend on combination of materials characteristics and testing geometry as well as experimental protocol (contact time, contact...

Quantitative comparison of adhesion in metal-to-plastic systems

A peel test device was used to monitor metal-polymer adhesion. This technique showed variations in the resulting force within 1%, and enabled the ranking of many systems. A change in the 50 nm-adhesion layer resulted in a variation of the fracture energy by a factor 2.3. A change of the substrate led to a change in adhesion by a factor 40. The...