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Sadeghian Marnani, H. (author), Herfst, R.W. (author), van den Dool, T.C. (author), Crowcombe, W.E. (author), Winters, J. (author), Kramers, G.F.I.J. (author)Scanning probe microscopy (SPM) is a promising candidate for accurate assessment of metrology and defects on wafers and masks, however it has traditionally been too slow for high-throughput applications, although recent developments have significantly pushed the speed of SPM [1,2]. In this paper we present new results obtained with our...conference paper 2014
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- Crowcombe, W.E. (author), Hollemans, C.L. (author), Fritz, E.C. (author), van der Donck, J.C.J. (author), Koster, N.B. (author) other 2014
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Sadeghian Marnani, H. (author), van den Dool, T.C. (author), Crowcombe, W.E. (author), Herfstra, R.W. (author), Winters, J. (author), Kramers, G.F.I.J. (author), Koster, N.B. (author)With the device dimensions moving towards the 1X node, the semiconductor industry is rapidly approaching the point where 10 nm defects become critical. Therefore, new methods for improving the yield are emerging, including inspection and review methods with sufficient resolution and throughput. Existing industrial tools cannot anymore fulfill...conference paper 2014
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Crowcombe, W.E. (author), Hollemans, C.L. (author), Fritz, E.C. (author), van der Donck, J.C.J. (author), Koster, N.B. (author)Particle free handling of EUV reticles is a major concern in industry. For reaching economically feasible yield levels, it is reported that Particle-per-Reticle-Pass (PRP) levels should be better than 0.0001 for particles larger than 18 nm. Such cleanliness levels are yet to be reported for current reticle handling systems. A reticle handler was...conference paper 2014
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