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Yazdan Mehr, M. (author), Bahrami, A. (author), Fischer, H.R. (author), Gielen, S. (author), Corbeij, R. (author), van Driel, W.D. (author), Zhang, G.Q. (author)
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning...
conference paper 2015