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Gielen, A.W.J. (author), Barink, M. (author), van de Brand, J. (author), van Mol, A.M.B. (author), TNO Industrie en Techniek (author)
In order to study the electrical-thermo-mechanical interaction in OLEDs, finite element based simulation models were developed. Two dimensional models were used to study detailed design effects, such as the location of the bus bars, while a three dimensional model was used to study the effect of differences between the two and three dimensional...
conference paper 2009
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Kregting, R. (author), Gielen, A.W.J. (author), van Driel, W. (author), Alkemade, P. (author), Miro, H. (author), Kamminga, J.-D. (author), TNO Industrie en Techniek (author)
Intrinsic stresses in bondpads may lead to early failure of IC's. In order to determine the intrinsic stresses in semiconductor structures, a new procedure is set up. This procedure is a combined experimental/numerical approach which consists of the following steps: First, a conductive gold layer (20 nm thickness) is deposited on the power line...
conference paper 2010
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Gielen, A.W.J. (author), TNO Industrie en Techniek (author)
Automotive electronics, solid-state-lighting, and solar cells need have to operate under harsh circumstances, either by the kind of environment they operate in, such as automotive electronics under the hood, or by the long durations of exposure. In both cases traditional lifetime assessment methods are failing: The accelaration factors, who are...
conference paper 2010
document
Yuan, C.A. (author), Kregting, R. (author), van Driel, W. (author), Gielen, A.W.J. (author), Xiao, A. (author), Zhang, G.Q. (author)
High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital...
conference paper 2011
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Yazdan Mehr, M. (author), Bahrami, A. (author), Fischer, H.R. (author), Gielen, S. (author), Corbeij, R. (author), van Driel, W.D. (author), Zhang, G.Q. (author)
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning...
conference paper 2015
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Tapaninen, O. (author), Myohanen, P. (author), Majanen, M. (author), Sitomaniemi, A. (author), Olkkonen, J. (author), Hildenbrand, V. (author), Gielen, A.W.J. (author), Mackenzie, F.V. (author), Barink, M. (author), Smilauer, V. (author), Patzak, B. (author)
This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This...
conference paper 2016
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