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Turkenburg, D. (author), Hartley, J. (author), Fischer, H. (author), Roebroeks, G. (author), Ward, C. (author), Gielen, S. (author)
conference paper 2016
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Tapaninen, O. (author), Myohanen, P. (author), Majanen, M. (author), Sitomaniemi, A. (author), Olkkonen, J. (author), Hildenbrand, V. (author), Gielen, A.W.J. (author), Mackenzie, F.V. (author), Barink, M. (author), Smilauer, V. (author), Patzak, B. (author)
This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This...
conference paper 2016
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Gielen, A.W.J. (author), Mackenzie, F.O. Valega (author)
We have developed a multi-scale model, consisting of an atomistic model in LAMMPS of an InSb nanowire, and a continuum model in COMSOL of a socalled Majorana research device, to study the effects of thermo-mechanical deformations during the cool down from room temperature to the operating temperature of about 50 mK. For the simulation of the...
conference paper 2015
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Fischer, H.R. (author), Nabi, H.S. (author), Weiss, L. (author), Gielen, A.W.J. (author)
Molding compounds are key materials to deliver well packaged reliable IC’s for demanding applications, such as automotive electronics. With shrinking sizes of IC’s and the increased requirements with respect to loading conditions, application environment and lifetime, the reliability of the packaging becomes increasingly important. The...
conference paper 2015
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Yazdan Mehr, M. (author), Bahrami, A. (author), Fischer, H.R. (author), Gielen, S. (author), Corbeij, R. (author), van Driel, W.D. (author), Zhang, G.Q. (author)
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning...
conference paper 2015
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Gielen, A.W.J. (author), McKenzie, F.V. (author)
In the last few years Technical University of Delft, under leadership of Prof.dr.ir. Leo Kouwenhoven, has developed several successful concepts for quantum devices that are suitable for quantum computing and quantum communication. From a quantum research point of view we are still in a very fundamental state, several practical issues already...
conference paper 2014
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Veninga, E.P. (author), Kregting, R. (author), van der Waal, A. (author), Gielen, A.W.J. (author)
The introduction of new materials or technologies can have an enormous impact on the Time to Market (TTM) of new products. Preferably, the performance of new materials or technologies is known before these are designed into a product. This paper presents a reliability assessment approach which has been developed with the aim to reduce the so...
conference paper 2013
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Ye, H. (author), van Zeijl, H. (author), Sokolovskij, R. (author), Gielen, A.W.J. (author), Zhang, G.Q. (author)
Light-emitting diodes (LEDs) are revolutionizing the illumination with energy savings and enhanced functionality. However, around 80% of the input power will be still transferred to heat. As the elevated temperature negatively affects the maximum light output, efficiency, quality, reliability and the lifetime of the SSL systems, thermal...
conference paper 2013
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de Borst, E.C.M. (author), Gielen, A.W.J. (author), Etman, L.F.P. (author)
This paper introduces an approach to study the coupling structure between the design parameters and design objectives of a LED system-in-package (SiP) design concept [1]. The LED SiP is an integrated device that combines the LED chip with driver chips and potential other components in a single package, simplifying the design of lighting products...
conference paper 2012
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Farley, D.M. (author), Boschman, F. (author), Bullema, J.E. (author), Gielen, A.W.J. (author), Hesen, P. (author), Krugers, J.P.H.M. (author), Swartjes, F. (author), van Zeijl, H. (author), Zhang, G.Q. (author)
The reliability assessment aspect of the LED field is not fully developed. The lack of complete understanding is due, in part, to the newness of the field. SSL has not existed long enough to directly gauge the accuracy of the Lifetime Assessments being made. The approach of using simulation in qualification to Lifetime Assessment is one of the...
conference paper 2012
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Bullema, J.E. (author), Werkhoven, R.J. (author), Gielen, A.W.J. (author), Kunen, J.M.G. (author), Hesen, P. (author), Swartjes, F.H.M. (author), Boschman, F. (author)
Intelligent LED lighting systems can save up to 80% of energy compared to incandescent lighting systems. In order to provide these products at reasonable costs, integration and miniaturization are important steps [1]. Another attractive feature of LED systems is the claimed long life expectancy. The design lifetime of LED luminaries is typically...
conference paper 2012
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Yuan, C.A. (author), Kregting, R. (author), van Driel, W. (author), Gielen, A.W.J. (author), Xiao, A. (author), Zhang, G.Q. (author)
High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital...
conference paper 2011
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Yuan, C.A. (author), Kregting, R. (author), Ye, H. (author), van Driel, W. (author), Gielen, A.W.J. (author), Zhang, G.Q. (author)
Power electronics, such as high power RF components and high power LEDs, requires the combination of robust and reliable package structures, materials, and processes to guarantee their functional performance and lifetime. We started with the thermal and thermal-mechanical modeling of such component performances. With robust validation....
conference paper 2011
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Gielen, A.W.J. (author), Hesen, P. (author), Swartjes, F.H.M. (author), van Zeijl, H. (author), Boschman, F. (author), Bullema, J.-E. (author), Werkhoven, R.J. (author), Koh, S. (author)
Intelligent LED lighting systems can save up to 80% of energy compared to traditional lighting systems. In order to provide these intelligent lighting products at reaseonable costs, integration and miniaturisation are important steps. To this end we have designed a LED system-in-package that combines LEDs, driver ICs, and passives into a single...
conference paper 2011
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Ye, H. (author), Gielen, A.W.J. (author), van Zeijl, H.W. (author), Werkhoven, R.J. (author), Zhang, G.Q. (author)
The increased electrical currents used to drive light emitting diode (LED) cause significant heat generation in the solid state lighting (SSL) system. As the temperature will directly affect the maximum light output, quality, reliability and the life time of the SSL system, thermal management is a key design aspect in terms of cost and...
conference paper 2011
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Kregting, R. (author), Gielen, A.W.J. (author), van Driel, W. (author), Alkemade, P. (author), Miro, H. (author), Kamminga, J.-D. (author), TNO Industrie en Techniek (author)
Intrinsic stresses in bondpads may lead to early failure of IC's. In order to determine the intrinsic stresses in semiconductor structures, a new procedure is set up. This procedure is a combined experimental/numerical approach which consists of the following steps: First, a conductive gold layer (20 nm thickness) is deposited on the power line...
conference paper 2010
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Gielen, A.W.J. (author), TNO Industrie en Techniek (author)
Automotive electronics, solid-state-lighting, and solar cells need have to operate under harsh circumstances, either by the kind of environment they operate in, such as automotive electronics under the hood, or by the long durations of exposure. In both cases traditional lifetime assessment methods are failing: The accelaration factors, who are...
conference paper 2010
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Veninga, E.P. (author), Gielen, A.W.J. (author), TNO Industrie en Techniek (author)
conference paper 2010
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Gielen, A.W.J. (author), Barink, M. (author), van de Brand, J. (author), van Mol, A.M.B. (author), TNO Industrie en Techniek (author)
In order to study the electrical-thermo-mechanical interaction in OLEDs, finite element based simulation models were developed. Two dimensional models were used to study detailed design effects, such as the location of the bus bars, while a three dimensional model was used to study the effect of differences between the two and three dimensional...
conference paper 2009
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Gielen, A.W.J. (author), TNO Bouw en Ondergrond (author)
conference paper 2008
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