Print Email Facebook Twitter Systems-in-foil: Devices, fabrication processes and reliability issues Title Systems-in-foil: Devices, fabrication processes and reliability issues Author van den Brand, J. de Baets, J. van Mol, A.M.B. Dietzel, A.H. TNO Industrie en Techniek Publication year 2008 Abstract Systems-in-foil are a new class of electronics in which a full system is integrated into a flexible end product. In this paper, we discuss current research activities and state-of-the-art in this field. Furthermore, some of the associated and expected reliability issues will be addressed on the basis of three examples. As a first example we discuss a flexible large area polymeric organic light-emitting (OLED) device. The reliability targets of these devices require protection against the detrimental influence of water. As a second example, we describe a technology for embedding thinned Si chips between polymeric foils where a careful selection of the base materials is important to account for thermal expansion differences. Finally, as a third example, a novel technology for embedding conductive circuitry in a polymeric foil is discussed in which a good matching of the elastic moduli of the polymeric foil and the embedded circuitry is crucial for the flexibility robustness. Subject Elastic moduliOptical designOrganic light emitting diodes (OLED)SiliconThermal sprayingWater conservationFabrication processesOrganic light-emittingThermal expansion To reference this document use: http://resolver.tudelft.nl/uuid:e781324c-c715-49d9-a5bd-7ac2a1a9f6cd TNO identifier 240935 Publisher Elsevier, Amsterdam ISSN 0026-2714 Source Microelectronics Reliability, 48 (8-9), 1123-1128 Document type article Files To receive the publication files, please send an e-mail request to TNO Library.