Title
Integration in design and manufacturing of polymer smart devices
Author
Bolt, P.J.
de Zwart, R.M.
Tacken, R.A.
Rendering, H.
TNO Industrie en Techniek
Publication year
2009
Abstract
Integration of functions in single components is pursued in order to manufacture smaller and smarter polymer micro devices at less cost, through e.g. less assembly steps. It requires integration on both product and production side. This paper addresses the use of molded interconnect device (MID) technology for the integration of electronic circuitry into polymer products. Shown will be new approaches of selective metallization for creating conductive tracks. The supply chain of MID parts is still seen as vulnerable, resulting in concerns on reliability of production and product. A solution is integration of processes in one production cell. Shown is the feasibility of integrating a surface patterning process into an injection molding tool.
Subject
Injection molding
Integration
Metallization
To reference this document use:
http://resolver.tudelft.nl/uuid:6ad37f9c-4a77-4cc0-97c2-36ac04906f3d
TNO identifier
248213
ISBN
9781615673278
Source
67th Annual Technical Conference of the Society of Plastics Engineers 2009, ANTEC 2009, 22 June 2009 through 24 June 2009, Chicago, IL. Conference code: 78175, 5, 3011-3015
Series
Annual Technical Conference - ANTEC, Conference Proceedings
Document type
conference paper