Title
Systems-in-foil: Devices, fabrication processes and reliability issues
Author
van den Brand, J.
de Baets, J.
van Mol, A.M.B.
Dietzel, A.H.
TNO Industrie en Techniek
Publication year
2008
Abstract
Systems-in-foil are a new class of electronics in which a full system is integrated into a flexible end product. In this paper, we discuss current research activities and state-of-the-art in this field. Furthermore, some of the associated and expected reliability issues will be addressed on the basis of three examples. As a first example we discuss a flexible large area polymeric organic light-emitting (OLED) device. The reliability targets of these devices require protection against the detrimental influence of water. As a second example, we describe a technology for embedding thinned Si chips between polymeric foils where a careful selection of the base materials is important to account for thermal expansion differences. Finally, as a third example, a novel technology for embedding conductive circuitry in a polymeric foil is discussed in which a good matching of the elastic moduli of the polymeric foil and the embedded circuitry is crucial for the flexibility robustness.
Subject
Elastic moduli
Optical design
Organic light emitting diodes (OLED)
Silicon
Thermal spraying
Water conservation
Fabrication processes
Organic light-emitting
Thermal expansion
To reference this document use:
http://resolver.tudelft.nl/uuid:e781324c-c715-49d9-a5bd-7ac2a1a9f6cd
TNO identifier
240935
Publisher
Elsevier, Amsterdam
ISSN
0026-2714
Source
Microelectronics Reliability, 48 (8-9), 1123-1128
Document type
article