Title
Melting of copper surface by ultrashort laser pulses
Author
Oboňa, J.V.
Ocelík, V.
de Hosson, J.T.M.
Skolski, J.Z.P.
Mitko, V.S.
Römer, G.R.B.E.
Huis in 't Veld, A.J.
Contributor
de Hosson, J.T.M. (editor)
Brebbia, C.A. (editor)
Publication year
2011
Abstract
The main advantage of ultrashort laser pulses in manufacturing technology is their very high removal rate of material and high quality of microstructures with the smallest dimensions at 1 μm level. The accuracy is mainly due to an almost absence of thermal diffusion into bulk material. In this paper we report the investigation on polycrystalline Cu sample surface treated by 6.7 ps laser pulses with 1030 nm laser light wavelength. Scanning electron microscopy micrographs reveal the presence of jet-like structures with spherical drop-like endings, solidified spheres and many bubble bursts at even lower fluence than the threshold value for the ablation is. Within the molten material the jet-like features are due to an explosion of bubbles originated in solid-liquid-vapor transitions. In the case of below-threshold irradiation, the same objects can be seen along surface scratches, dot contaminations etc., which indicate an increase of the laser light absorption on these inhomogeneities. © 2011 WIT Press.
Subject
Mechatronics, Mechanics & Materials
TFT - Thin Film Technology
TS - Technical Sciences
Physics
Industrial Innovation
Bubbles
Copper
Electron microscopy
Jets
Laser pulses
Membrane
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http://resolver.tudelft.nl/uuid:cb7033a5-eda6-477e-9fa4-10c91eadbf70
DOI
https://doi.org/10.2495/secm110151
TNO identifier
463757
ISBN
9781845645304
ISSN
1743-3533
Source
10th International Conference on Surface Effects and Contact Mechanics, Computational Methods and Experiments, SECM11, 21-23 September 2011, Malta, 71, 171-179
Series
WIT Transactions on Engineering Sciences
Document type
conference paper