Print Email Facebook Twitter Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Title Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Author Roozeboom, F. Contributor Knechtel, R. (editor) Tan, C.S. (editor) Suga, T. (editor) Baumgart, H. (editor) Goorsky, M.S. (editor) Fournel, F. (editor) Hobart, K.D. (editor) Roozeboom, F. (editor) Publication year 2020 Subject Industrial Innovation To reference this document use: http://resolver.tudelft.nl/uuid:c5936ce4-3b65-4c46-b5e8-ea1024593f9a TNO identifier 881949 Publisher ECS, Pennington, NJ, US ISBN 9781607688990 ISSN 1938-5862 Series ECS Transactions Bibliographical note Symposium Semiconductor Wafer Bonding: Science, Technology and Applications 16, held during PRiME 2020. This meeting was originally meant to be held in Honolulu, Hawaii, from October 4-9, 2020. With respect to the ongoing worldwide COVID-19 pandemic, this meeting became a virtual event. Document type conference paper Files To receive the publication files, please send an e-mail request to TNO Library.