Title
Semiconductor Wafer Bonding: Science, Technology, and Applications 16
Author
Roozeboom, F.
Contributor
Knechtel, R. (editor)
Tan, C.S. (editor)
Suga, T. (editor)
Baumgart, H. (editor)
Goorsky, M.S. (editor)
Fournel, F. (editor)
Hobart, K.D. (editor)
Roozeboom, F. (editor)
Publication year
2020
Subject
Industrial Innovation
To reference this document use:
http://resolver.tudelft.nl/uuid:c5936ce4-3b65-4c46-b5e8-ea1024593f9a
TNO identifier
881949
Publisher
ECS, Pennington, NJ, US
ISBN
9781607688990
ISSN
1938-5862
Series
ECS Transactions
Bibliographical note
Symposium Semiconductor Wafer Bonding: Science, Technology and Applications 16, held during PRiME 2020. This meeting was originally meant to be held in Honolulu, Hawaii, from October 4-9, 2020. With respect to the ongoing worldwide COVID-19 pandemic, this meeting became a virtual event.
Document type
conference paper