Title
3D Advance Metrology by means of 3D Atomic Force Microscopy
Author
Herfst, R.W.
Nulkes-de Groot, N.
Lucas, P.
Bijnagte, T.
Dekker, B.
Biemond, J.J.B.
van Riel, M.J.C.M.
van Essen, B.H.M.F.
van Koppen, M.E.C.T.
Oosterling, J.A.J.
Kramer, L.
Nieuwkoop, E.
Corbet, F.
Visser, L.
Man, H.
Publication year
2019
Abstract
We developed a new 3D-AFM technique that enables imaging of high aspect ratio trenches. By measuring both lateral and vertical forces on a cantilever tip, a subharmonic mode based on the attractive tip-sample forces becomes feasible. This enables the measurement of true 3D information of samples without causing damage. This is especially relevant for semiconductor metrology, as current solutions are lagging behind the development of (near-future) lithography capabilities. Our goal: measure metrology parameters such as critical dimension (CD), side wall angle (SWA), Line edge Roughness (LER), etc.
Subject
High Tech Systems & Materials
Industrial Innovation
Metrology
Microscopy
3D atomic force microscopy
ERP Early Research Program
ERP 3D Nanomanufacturing Instruments
To reference this document use:
http://resolver.tudelft.nl/uuid:bfc8427a-bf6b-468d-bc20-ae3fef92a351
TNO identifier
867637
Publisher
TNO, Delft
Source
SID Semicon Innovation Day, Science Centre Delft, 21 May 2019
Bibliographical note
Presented poster
Document type
other