Title
Flexible electronics: Prediction of substrate deformation during different steps of the lithography process
Author
Barink, M.
van den Berg, D.
Yakimets, I.
Giesen, P.
van Dommelen, J.A.W.
Meinders, E.R.
Publication year
2011
Abstract
A numerical model was developed to simulate the micro-deformations of a polymeric substrate due to lithographic processing of different layers of a transistor-like structure. The results of the model were validated with the results from experiments. The model, a mechanical-thermal-hygroscopic model, takes into account the dimensional effects of temperature, moisture and stresses. It also includes the temperature dependent visco-elastic behaviour of the polymer substrate. The model can be used to predict overlay accuracies between different functional layers introduced by the lithographic process. It can also be used to understand the underlying processes such that it provides a tool to improve the overlay accuracy during actual processing. © 2010 Elsevier B.V. All rights reserved.
Subject
Mechatronics, Mechanics & Materials
HOL - Holst
TS - Technical Sciences
High Tech Systems & Materials
Materials
Industrial Innovation
Flexible electronics
Flexible substrate
Freestanding
Lithography
Polymer film
Processing
Thermo-hygro-mechanical model
To reference this document use:
http://resolver.tudelft.nl/uuid:ac012076-4b87-482c-a9b2-31f09358f437
TNO identifier
428127
ISSN
0167-9317
Source
Microelectronic Engineering, 88 (6), 999-1005
Document type
article