Print Email Facebook Twitter Flexible electronics: Prediction of substrate deformation during different steps of the lithography process Title Flexible electronics: Prediction of substrate deformation during different steps of the lithography process Author Barink, M. van den Berg, D. Yakimets, I. Giesen, P. van Dommelen, J.A.W. Meinders, E.R. Publication year 2011 Abstract A numerical model was developed to simulate the micro-deformations of a polymeric substrate due to lithographic processing of different layers of a transistor-like structure. The results of the model were validated with the results from experiments. The model, a mechanical-thermal-hygroscopic model, takes into account the dimensional effects of temperature, moisture and stresses. It also includes the temperature dependent visco-elastic behaviour of the polymer substrate. The model can be used to predict overlay accuracies between different functional layers introduced by the lithographic process. It can also be used to understand the underlying processes such that it provides a tool to improve the overlay accuracy during actual processing. © 2010 Elsevier B.V. All rights reserved. Subject Mechatronics, Mechanics & MaterialsHOL - HolstTS - Technical SciencesHigh Tech Systems & MaterialsMaterialsIndustrial InnovationFlexible electronicsFlexible substrateFreestandingLithographyPolymer filmProcessingThermo-hygro-mechanical model To reference this document use: http://resolver.tudelft.nl/uuid:ac012076-4b87-482c-a9b2-31f09358f437 TNO identifier 428127 ISSN 0167-9317 Source Microelectronic Engineering, 88 (6), 999-1005 Document type article Files To receive the publication files, please send an e-mail request to TNO Library.