Print Email Facebook Twitter Upscaling, integration and electrical characterization of molecular junctions Title Upscaling, integration and electrical characterization of molecular junctions Author van Hal, P.A. Smits, E.C.P. Geuns, T.C.T. Akkerman, H.B. de Brito, B.C. Perissinotto, S. Lanzani, G. Kronemeijer, A.J. Geskin, V. Cornil, J. Blom, P.W.M. de Boer, B. de Leeuw, D.M. TNO Industrie en techniek Publication year 2008 Abstract The ultimate target of molecular electronics is to combine different types of functional molecules into integrated circuits, preferably through an autonomous self-assembly process. Charge transport through self-assembled monolayers has been investigated previously, but problems remain with reliability, stability and yield, preventing further progress in the integration of discrete molecular junctions. Here we present a technology to simultaneously fabricate over 20,000 molecular junctions—each consisting of a gold bottom electrode, a self-assembled alkanethiol monolayer, a conducting polymer layer and a gold top electrode—on a single 150-mm wafer. Their integration is demonstrated in strings where up to 200 junctions are connected in series with a yield of unity. The statistical analysis on these molecular junctions, for which the processing parameters were varied and the influence on the junction resistance was measured, allows for the tentative interpretation that the perpendicular electrical transport through these monolayer junctions is factorized. Subject Electronics To reference this document use: http://resolver.tudelft.nl/uuid:8e590c94-46ac-4eb3-b968-bb9816027d6d TNO identifier 441390 Source Nature Nanotechnology, 4, 249-254 Document type article Files To receive the publication files, please send an e-mail request to TNO Library.