Title
Electro-deposition as a repair method for embedded metal grids
Author
Oostra, A.J.
Reddy, A.
Smits, E.C.P.
Abbel, R.J.
Groen, W.A.
Blom, P.W.M.
Michels, J.J.
Publication year
2016
Abstract
A method is presented to self-repair cracks in embedded silver grid structures used in large area organic electronics. The repair procedure is based on electro-deposition, incited by the application of a moderate DC voltage across the crack. During this process the organic anode that is in direct electrical contact with the silver grid, functions as an appropriate medium for ion migration. Restoration of conductivity is achieved by the formation of dendritic metal structures that connect the cathodic to the anodic side of the crack. The metal dendrites decrease the gap resistance by one order of magnitude. Subsequently, another three orders of magnitude are gained upon sintering the dendrites using a high voltage pulse, yielding restored conductance levels nearly within one order of magnitude difference from native track conductance. cop. 2016 Elsevier B.V.All rights reserved.
Subject
Nano Technology
HOL - Holst
TS - Technical Sciences
Electronics
Industrial Innovation
Devices
Electromigration
Metal grid
Organic light emitting diodes
OLED
Organic photovoltaics
Repair
Cracks
To reference this document use:
http://resolver.tudelft.nl/uuid:78741e81-6f27-4210-8519-d8bd1bc1cdd8
DOI
https://doi.org/10.1016/j.tsf.2016.01.060
TNO identifier
534100
Publisher
Elsevier
ISSN
0040-6090
Source
Thin Solid Films, 603, 202-205
Document type
article