Print Email Facebook Twitter Roll-to-roll paper sensors (ROPAS); Wireless communicating sensors on paper in the logistic chain Title Roll-to-roll paper sensors (ROPAS); Wireless communicating sensors on paper in the logistic chain Author Rentrop, C. Rubingh, J.E.J.M. Lelieveld, R. Sandberg, H. Publication year 2014 Abstract The ROPAS project (Roll-to-roll paper sensors) combines high end electronics and wireless sensors with low cost paper substrates and processing techniques that can be applied on a large scale. Paper is the next step in the printed electronics roadmap of utilising cheaper substrate materials as a replacement of silicon and PET and is generally referred to as paper electronics. The creation of highly conductive structures applied at high speed on (temperature unstable) paper is extremely important to enable paper electronics. Hereto, recent advantages in nanotechnology such as (encapsulation) printing, surface modification of fiber based products, sensor and battery development, and electronic design (wireless communication) are integrated for large scale roll to roll and sheet to sheet paper applications. The possibilities of paper electronics are demonstrated in high impact (security) and logistics applications, which are demonstrated in security tags and smart labels for anti-counterfeiting purposes by e.g. integration of near field communication (NFC) in paper and finally track-and-trace post pieces such as envelopes. The paper explains the project and its impact, including implications of using a rough, coarse, porous and composite, paper substrate of limited high temperature stability on the design and fabrication of demonstrators and building blocks. Important topics herein are: fast curing of conductive inks on paper using state of the art printing techniques such as inkjet, screen and flexogravure. In the talk, synthesis of printable (humidity) sensor materials, placing of electrical components on paper surfaces including electronic design of the wireless communication and environmental and recycling constraints of the products are discussed as well. Subject Mechanics, Materials and StructuresMIP - Materials for Integrated ProductsTS - Technical SciencesElectronicsIndustrial InnovationMobile devicesPrintingSubstratesElectrical componentsNear field communicationsProcessing techniqueWireless communicationsPaper electronicsRoll-to-roll paper sensorsROPAS To reference this document use: http://resolver.tudelft.nl/uuid:6f450c1f-1f0f-4cf1-b481-daa8b234464b DOI https://doi.org/10.1109/estc.2014.6962775 TNO identifier 521626 Publisher Institute of Electrical and Electronics Engineers Inc. ISBN 9781479940264 Source Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014 Article number 6962775 Document type conference paper Files To receive the publication files, please send an e-mail request to TNO Library.