Title
MEMS silicon-based micro-evaporator with diamond-shaped fins
Author
Mihailovic, M.
Rops, C.
Creemer, J.F.
Sarro, P.M.
TNO Industrie en techniek
Publication year
2010
Abstract
A new design of micro-evaporators, with 45 channels (100 μm deep) and diamond-shaped fins (40μm wide, 160μm long, 20μm separation), is fabricated by anodic bonding of silicon and glass wafers, in a five masks process. This new design improves stability of the working conditions, and has a localized hot zone in the main part of the device. The measured absorbed heat includes the energy that heats up the coolant (water) from 25 to 100 ° C (roughly 300 J/g) and the latent heat of evaporation (2400 J/g). The latter one is a dominant term, and heat absorption is significantly increased at fin temperatures above the water boiling point.
Subject
Mechatronics, Mechanics & Materials
EAM - Equipment for Additive Manufacturing
TS - Technical Sciences
Chemistry
Anodic bonding
Heat transfer
Two-phase flow
Anodic bonding
Fin temperature
Glass wafer
Heat absorption
Hot zone
New design
Silicon-based
Working conditions
Evaporators
Fins (heat exchange)
Forced convection
Heat transfer
Hot working
Semiconducting silicon compounds
Silicon wafers
Two phase flow
Water absorption
Glass bonding
To reference this document use:
http://resolver.tudelft.nl/uuid:699ea9f2-6fb5-4a56-b1e2-1b6ebd915604
DOI
https://doi.org/10.1016/j.proeng.2010.09.270
TNO identifier
427575
ISSN
1877-7058
Source
24th Eurosensors Conference, 5 September 2010 through 8 September 2010, Linz. Conference code: 83056, 5, 969-972
Series
Procedia Engineering
Document type
conference paper