Title
High-throughput scanning probe instruments for nanopatterning, alignment, and overlay metrology
Author
Navarro, V.
Mohtashami, A.
Herfst, R.W.
Maturova, K.
van Es, M.H.
Piras, D.
Sadeghian Marnani, H.
Contributor
Sanchez, M.I. (editor)
Panning, E.M. (editor)
Publication year
2018
Abstract
As the pitch approaches the 10nm node, in order to meet current and future patterning challenges, high resolution techniques are required, complementary to extreme ultraviolet lithography (EUVL) for high volume manufacturing of nanodevices. These complementary techniques should have the following specifications: 1) High patterning resolution, below 10 nm; 2) capability of patterning in 3D; 3) sufficient wafer-scale throughput; 4) the capability of closed loop metrology and 5) the capability of measuring nondestructively through layers, for alignment and overlay applications. Scanning probe microscopy (SPM) has shown a great degree of nano-scale control, and a great potential to address the challenges found in metrology. There has been a broad development of SPM-based methods for patterning and metrology purposes although its exploitation for technological applications is limited due to the modest throughput of scanning probe based techniques. In this article we present experimental results that include the proof-of-principle of using SSURFM to locate existing buried nanopatterns (lines of 50 nm) and subsequently using our patterning technology to manufacture nanocontact holes aligned to the existing buried lines. In combination with the high throughput parallel scanning probe, this example demonstrates the great potential and the suitability of the group of technologies developed at TNO (consisting of the patterning and the subsurface nanoimaging) for alignment and overlay, especially through opaque layers.
Subject
High Tech Systems & Materials
Electronics
Industrial Innovation
Alignment and overlay
Patterning
Scanning probe lithography
Extreme ultraviolet lithography
Manufacture
Nanotechnology
Scanning probe microscopy
Contact holes
High throughput
Sub-surface imaging
To reference this document use:
http://resolver.tudelft.nl/uuid:5f35fec0-b3e1-417d-94c8-27a8677f3164
TNO identifier
842137
Publisher
SPIE
ISBN
9781510616608
ISSN
0277-786X
Source
Novel Patterning Technologies, San Jose, CA, USA, 26 February - 1 March 2018, 10584
Series
Proceedings of SPIE - The International Society for Optical Engineering
Article number
1058404
Document type
conference paper