Title
High resolution acoustic metrology by combining high GHZ frequency ultrasound and scanning probe microscopy
Author
van Es, M.H.
Quesson, B.A.J.
Mohtashami, A.
Piras, D.
Hatakeyama, K.
Fillinger, L.
van Neer, P.L.M.J.
Contributor
Robinson, J.C. (editor)
Adan, O. (editor)
Publication year
2020
Abstract
In order to extract ever more performance from semiconductor devices on the same device area, the semiconductor industry is moving towards device structures with increasingly complex material combinations and 3D geometries. To ensure cost effective fabrication of next generation devices, metrology solutions are needed that tackle the specific challenges that come from these developments such as 3 dimensional imaging of structures and imaging of deeply buried structures under arbitrary, complex layers. Compared to existing metrology solutions for high end manufacturing, ultrasonic inspection techniques have advantages: they are unaffected by optically opaque layers, the acoustic wavelength (60nm @ 100GHz in SiO2) can be smaller than optical wavelengths and the measurement depth can be larger. However, traditional acoustic microscopy tops out at a few GHz due to manufacturing tolerances and the required liquid couplant. We propose to combine very high frequency ultrasound with scanning probe microscopy. By locating the transducer above the cantilever tip, it guides sound into the sample with a dry tip-sample contact. This allows for very high acoustic frequencies and a resolution of O(wavelength). © 2020 SPIE.
Subject
Acoustic Microscopy
Buried Structures
High Resolution
Scanning Probe Microscopy
Acoustic variables measurement
Cost effectiveness
Fits and tolerances
Hydrophobicity
Inspection
Scanning probe microscopy
Semiconductor device manufacture
Semiconductor device structures
Semiconductor devices
Silica
Ultrasonic testing
Acoustic metrologies
Acoustic wavelength
Cost-effective fabrication
Manufacturing tolerances
Semiconductor industry
Ultrasonic inspections
Very high frequency
Process control
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http://resolver.tudelft.nl/uuid:4a5edec8-595b-4585-9054-544c90f6ffa9
TNO identifier
875946
Publisher
SPIE
ISBN
9781510634176
ISSN
0277-786X
Source
Proceedings of SPIE - The International Society for Optical Engineering, Metrology, Inspection, and Process Control for Microlithography XXXIV 2020, 24 February 2020 through 27 February 2020
Article number
113250C
Bibliographical note
Sponsor: Nova Measuring, Ltd.;The Society of Photo-Optical Instrumentation Engineers (SPIE)
Document type
conference paper