Title
Polymer-based 2D/3D wafer level heterogeneous integration for SSL module
Author
Yuan, C.
Wei, J.
Ye, H.
Koh, S.
Harianto, S.
van den Nieuwenhof, M.A.
Zhang, G.Q.
Publication year
2012
Abstract
This paper demonstrates a heterogeneous integration of solid state lighting (SSL) module, including light source (LED) and driver/control components. Such integration has been realized by the polymer-based reconfigured wafer level package technologies and such structure has been prototyped and tested. The structure design, thermal design consideration, material selection & process technologies, and mechanical challenges will be also described in this paper. © 2012 IEEE.
Subject
Mechatronics, Mechanics & Materials
MIP - Materials for Integrated Products
TS - Technical Sciences
Materials
Industrial Innovation
polymer based package
reconfigured wafer
Solid state lighting
Wafer level packaging
To reference this document use:
http://resolver.tudelft.nl/uuid:37390891-4b7d-4833-8801-ccc6b1f5c4f9
TNO identifier
460787
ISBN
9781467315128
Source
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 16 April 2012 through 18 April 2012, Cascais
Article number
6191808
Document type
conference paper