Polymer-based 2D/3D wafer level heterogeneous integration for SSL module
van den Nieuwenhof, M.A.
This paper demonstrates a heterogeneous integration of solid state lighting (SSL) module, including light source (LED) and driver/control components. Such integration has been realized by the polymer-based reconfigured wafer level package technologies and such structure has been prototyped and tested. The structure design, thermal design consideration, material selection & process technologies, and mechanical challenges will be also described in this paper. © 2012 IEEE.
Mechatronics, Mechanics & Materials
To reference this document use:
MIP - Materials for Integrated Products
TS - Technical Sciences
polymer based package
Solid state lighting
Wafer level packaging
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 16 April 2012 through 18 April 2012, Cascais