Print Email Facebook Twitter Anodic bonding using the low expansion glass ceramic Zerodur® Title Anodic bonding using the low expansion glass ceramic Zerodur® Author van Elp, J. Giesen, P.T.M. van der Velde, J.J. TNO Industrie en Techniek Publication year 2005 Abstract Using anodic bonding, a strong bond has been created between the ultralow expansion glass ceramic Zerodur® from Schott and an Al coated piece of ultralow expansion glass (ULE® from Corning). The bond strength has been tested using a tensile testing machine. The bond strength is comparable to the fracture strength of the ULE® material. Using anodic bonding it will be possible to make complicated electrostatic clamps for the next generation lithography machines based on an all ultralow expansion design. Subject High Tech Systems & MaterialsIndustrial InnovationAluminumCeramic materialsCoated materialsElectrostaticsFracture toughnessGlassLithographyTensile testingAnodic bondingUltralow expansion glassAnodic oxidation To reference this document use: http://resolver.tudelft.nl/uuid:362e0efc-5a8c-4b61-826b-d5c3c4f1cfe6 TNO identifier 238854 Publisher American Institute of Physics AIP ISSN 1071-1023 Source Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 23 (1), 96-98 Document type article Files To receive the publication files, please send an e-mail request to TNO Library.