Title
Area selective atomic layer deposition method and tool
Author
Mameli, A.
Fawzy, A.
Roozeboom, F.
Poodt, P.W.G.
Publication year
2021
Abstract
The present disclosure concerns an atomic layer deposition device for area-selective deposition of a target material layer onto a deposition area of a substrate surface further comprising a non-deposition area. In use the substrate is conveyed along a plurality of deposition and separator spaces including at least two gas separator spaces provided with at least a separator gas inlet and a separator drain for, in use exposing the substrate to a separator gas flow. Wherein at least one of the gas separator spaces forms a combined separator-inhibitor gas flow comprising a separator gas and inhibitor moieties. The inhibitor moieties selectively adhering to the non-deposition area to form an inhibition layer reducing adsorption of precursor moieties. In a preferred embodiment the device includes a backetching space to increase selectivity of the deposition process.
Subject
ALD
Deposition method
Deposition tool
High Tech Systems & Materials
Industrial Innovation
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TNO identifier
959294
Report number
EP 3 822 389 A1
Publisher
European Patent Office
Document type
patent