Title
Thermal modeling for advanced high power packaging development and on-line performance monitoring
Author
Yuan, C.
Xiao, A.
Salta, J.
de Langen, M.
van Driel, W.
TNO Industrie en Techniek
Publication year
2010
Abstract
As the market demands for high power and high efficiency power electronics, the industries has developed advanced IC technology and conceptual configuration. However, in order to guarantee the performance and reliability of the power electronics, the challenge of the packaging arises. This paper will use the thermal measurements and finite element method to describe the thermal impact of the geometric unflatness and imperfection of packaging process. The results show that the unflatness of the package substrate impacts the thermal performance. The thinner the die, the more sensitive the process imperfection (voids at die attach layer) is. Afterwards, we apply the concept of Design for Testability (DIT), and a potential online quality control method for the power electronic manufacturing is used and the method to obtain the testing parameter is proposed.
Subject
Mechatronics, Mechanics & Materials
MIP - Materials for Integrated Products
TS - Technical Sciences
Materials
To reference this document use:
http://resolver.tudelft.nl/uuid:2cf15a4c-0f2d-4946-884e-556c872276df
DOI
https://doi.org/10.1109/estc.2010.5642900
TNO identifier
426837
ISBN
9781424485536
Source
3rd Electronics System Integration Technology Conference, ESTC 2010, 13 September 2010 through 16 September 2010, Berlin. Conference code: 83412
Article number
No.: 5642900
Document type
conference paper