Print Email Facebook Twitter Thermal modeling for advanced high power packaging development and on-line performance monitoring Title Thermal modeling for advanced high power packaging development and on-line performance monitoring Author Yuan, C. Xiao, A. Salta, J. de Langen, M. van Driel, W. TNO Industrie en Techniek Publication year 2010 Abstract As the market demands for high power and high efficiency power electronics, the industries has developed advanced IC technology and conceptual configuration. However, in order to guarantee the performance and reliability of the power electronics, the challenge of the packaging arises. This paper will use the thermal measurements and finite element method to describe the thermal impact of the geometric unflatness and imperfection of packaging process. The results show that the unflatness of the package substrate impacts the thermal performance. The thinner the die, the more sensitive the process imperfection (voids at die attach layer) is. Afterwards, we apply the concept of Design for Testability (DIT), and a potential online quality control method for the power electronic manufacturing is used and the method to obtain the testing parameter is proposed. Subject Mechatronics, Mechanics & MaterialsMIP - Materials for Integrated ProductsTS - Technical SciencesMaterials To reference this document use: http://resolver.tudelft.nl/uuid:2cf15a4c-0f2d-4946-884e-556c872276df DOI https://doi.org/10.1109/estc.2010.5642900 TNO identifier 426837 ISBN 9781424485536 Source 3rd Electronics System Integration Technology Conference, ESTC 2010, 13 September 2010 through 16 September 2010, Berlin. Conference code: 83412 Article number No.: 5642900 Document type conference paper Files To receive the publication files, please send an e-mail request to TNO Library.