Title
Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB 2
Author
Dow, W.-P.
Kondo, K.
Hayase, M.
Cvelbar, U.
Roozeboom, F.
Publication year
2019
Subject
Industrial Innovation
Materials
Physics
To reference this document use:
http://resolver.tudelft.nl/uuid:1ac76bd5-0fba-4ca4-895d-00c1c13dafed
TNO identifier
868857
Publisher
The Electrochemical Society, Pennington, NJ, US
ISBN
9781607688792
Source
ECS Transactions, 92 (5)
Bibliographical note
236th ECS Meeting in Atlanta, Oct. 13-17, 2019
Document type
conference paper