Print Email Facebook Twitter Narrow conductive structures with high aspect ratios through single-pass inkjet printing and evaporation-induced dewetting Title Narrow conductive structures with high aspect ratios through single-pass inkjet printing and evaporation-induced dewetting Author Abbel, R. Teunissen, P. Michels, J. Groen, W.A. Publication year 2015 Abstract Inkjet printed silver lines contract to widths below 20-μm during drying on an organic planarization coating. Aspect ratios previously unprecedented with single pass inkjet printing on isotropic homogeneous substrates are obtained. This effect is caused by the subsequent evaporation of solvents from the ink, which results in a continuous increase of its surface tension and thus controlled dewetting. cop. 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. Subject Nano TechnologyHOL - HolstTS - Technical SciencesMaterialsIndustrial InnovationInkjet printingDe-wettingHigh aspect ratioHomogeneous substratesPlanarization coatingsSingle passEvaporation To reference this document use: http://resolver.tudelft.nl/uuid:16234ac2-1c68-45f1-9160-488b49aa14b9 DOI https://doi.org/10.1002/adem.201400339 TNO identifier 525576 Publisher Wiley-VCH Verlag ISSN 1438-1656 Source Advanced Engineering Materials, 17 (5), 615-619 Document type article Files To receive the publication files, please send an e-mail request to TNO Library.