Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing
TNO Industrie en Techniek
Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often used as flexible substrate for plastic electronics. The model is validated with experimental foil behavior during a loading experiment and with the experimental bending behavior in a foil on-carrier situation. These kind of models are useful as they can be used to predict and to optimize lithographic process steps. ©2009 IEEE.
To reference this document use:
2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, 26 April 2009 through 29 April 2009, Delft