Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing
conference paper
Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often used as flexible substrate for plastic electronics. The model is validated with experimental foil behavior during a loading experiment and with the experimental bending behavior in a foil on-carrier situation. These kind of models are useful as they can be used to predict and to optimize lithographic process steps.
Topics
TNO Identifier
279984
ISBN
9781424441617
Article nr.
4938444
Source title
10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, 26-29 April 2009, Delft, The Netherlands
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