Title
Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing
Author
Barink, M.
Goorhuis, M.
Giesen, P.
Furthner, F.
Yakimets, I.
TNO Industrie en Techniek
Publication year
2009
Abstract
Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often used as flexible substrate for plastic electronics. The model is validated with experimental foil behavior during a loading experiment and with the experimental bending behavior in a foil on-carrier situation. These kind of models are useful as they can be used to predict and to optimize lithographic process steps. ©2009 IEEE.
Subject
Bending behavior
Environmental factors
Flexible substrate
Lithographic process
Lithography process
Loading experiment
Organic materials
Plastic electronics
Thermo-mechanical
Thermomechanical model
Experiments
Lithography
Microelectronics
Microsystems
Plastic products
Simulators
Thermomechanical treatment
Substrates
To reference this document use:
http://resolver.tudelft.nl/uuid:0b241733-5f9a-4356-82d5-f673d2963a60
DOI
https://doi.org/10.1109/esime.2009.4938444
TNO identifier
279984
ISBN
9781424441617
Source
2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, 26 April 2009 through 29 April 2009, Delft
Article number
4938444
Document type
conference paper