Print Email Facebook Twitter Low-cost millimeter-wave transceiver module using SMD packaged MMICs Title Low-cost millimeter-wave transceiver module using SMD packaged MMICs Author van Heijningen, M. Gauthier, G. Publication year 2004 Abstract This paper presents a novel approach to realize low-cost millimeter-wave modules using only SMD packaged MMICs integrated on a single organic substrate. This approach is demonstrated on a 38 GHz transceiver module for point-to-point LMDS communication systems. The required SMD package technology and demonstrator have been developed in the 5th framework European IST project "Surface Mount Assembly for Communication K-band Systems" (SMACKS). Two types of SMD packages have been developed based on LTCC technology for the low-power devices and an organic package for the high-power amplifier. The use of only packaged devices enables low-cost module manufacturing without the need for specialized equipment and without yield loss from handling bare die MMICs. The estimated cost reduction of such a module, with respect to a module using bare die components and mixed substrate technologies, is around 20%. A disadvantage of this approach is that the density of integration is low, since each active device is housed in its own package. Subject PhysicsCommunication systemsElectric linesFrequenciesLow temperature operationsMicrowavesMillimeter wavesSubstratesSurface mount technologyElectrical parametersOrganic packageSubstrate materialsSurface mount assembly for communication k-band systems (SMACKS)Transceivers To reference this document use: http://resolver.tudelft.nl/uuid:9297b760-4136-4f0a-9bd8-1724e5a706fa TNO identifier 214598 Source Conference Proceedings- 34th European Microwave Conference, 12-14 October 2004, London, Conference code: 64719, 3, 1269-1272 Series Conference Proceedings- European Microwave Conference Document type conference paper Files To receive the publication files, please send an e-mail request to TNO Library.