Low-cost millimeter-wave transceiver module using SMD packaged MMICs

Low-cost millimeter-wave transceiver module using SMD packaged MMICs

van Heijningen, M.
Gauthier, G.

2004

This paper presents a novel approach to realize low-cost millimeter-wave modules using only SMD packaged MMICs integrated on a single organic substrate. This approach is demonstrated on a 38 GHz transceiver module for point-to-point LMDS communication systems. The required SMD package technology and demonstrator have been developed in the 5th framework European IST project "Surface Mount Assembly for Communication K-band Systems" (SMACKS). Two types of SMD packages have been developed based on LTCC technology for the low-power devices and an organic package for the high-power amplifier. The use of only packaged devices enables low-cost module manufacturing without the need for specialized equipment and without yield loss from handling bare die MMICs. The estimated cost reduction of such a module, with respect to a module using bare die components and mixed substrate technologies, is around 20%. A disadvantage of this approach is that the density of integration is low, since each active device is housed in its own package.

Physics
Communication systems
Electric lines
Frequencies
Low temperature operations
Microwaves
Millimeter waves
Substrates
Surface mount technology
Electrical parameters
Organic package
Substrate materials
Surface mount assembly for communication k-band systems (SMACKS)
Transceivers

http://resolver.tudelft.nl/uuid:9297b760-4136-4f0a-9bd8-1724e5a706fa

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Conference Proceedings- 34th European Microwave Conference, 12-14 October 2004, London, Conference code: 64719, 3, 1269-1272

Conference Proceedings- European Microwave Conference

conference paper